Honeywell International Inc.

Honeywell G.m.b.h.

Jeffrey James Kriz

Robert Compton

Jeff A Ridley

Steven Tin

Mary Salit

James L Tucker

Kenneth Henry Heffner

Said E Abdelli

Steven J Eickhoff

Matthew Wade Puckett

Amit Lal

Chad Fertig

William Ross Rapoport

Christopher Kemper Ober

Karl D Nelson

Neil A Krueger

William Frank Witcraft

Brian W Schipper

Jennifer S Strabley

Kenneth Salit

James Douglas Seefeldt

Serhan Mehmet Ardanuc

Mark Daniel Dvorak

Chirag Patel

Ved Gund

Bradley A Kantor

Dennis D Ferguson

Jack Steven Croiter

Alex Ruyack

Katherine Camera

A thermal metamaterial device comprises at least one MEMS thermal switch, including a substrate layer including a first material having a first thermal conductivity, and a thermal bus over a first portion of the substrate layer. The thermal bus includes a second material having a second thermal conductivity higher than the first thermal conductivity. An insulator layer is over a second portion of the substrate layer and includes a third material that is different from the first and second materials. A thermal pad is supported by a first portion of the insulator layer, the thermal pad including the second material and having an overhang portion located over a portion of the thermal bus. When a voltage is applied to the thermal pad, an electrostatic interaction occurs to cause a deflection of the overhang portion toward the thermal bus, thereby providing thermal conductivity between the thermal pad and the thermal bus.

Thermal metamaterial for low power MEMS thermal control

An optical phase modulator comprises a cascaded array of optical resonators, wherein each of the optical resonators has an input port and an output port. A plurality of waveguides are coupled between the optical resonators and are configured to provide cascaded optical communication between the optical resonators. Each of the waveguides is respectively coupled between the output port of one optical resonator and the input port of an adjacent optical resonator. A transmission electrode is positioned adjacent to the optical resonators, with the transmission electrode configured to apply a drive voltage across the optical resonators. The optical phase modulator is operative to co-propagate an input optical wave with the drive voltage, such that a resonator-to-resonator optical delay is matched with a resonator-to-resonator electrical delay.

Cascaded resonant optical phase modulators for enhanced sensitivity while preserving linearity

A chip scale atomic clock (CSAC) includes a temperature stabilized physics system and a temperature stabilized electronics circuitry electrically coupled to the temperature stabilized physics system. Atomic clocks utilize an optical signal having a frequency component. The temperature stabilization increases frequency stability. The temperature stabilized physics system includes a vapor cell and a magnetic field coil, and is enclosed in a magnetic shield. When an ambient temperature of a chip scale atomic clock increases, fluid is extended away, due to thermal expansion, from at least one reservoir towards or away from a thermally isolated subsystem in at least one of the temperature stabilized electronics circuitry and the temperature stabilized physics system.

Apparatus and method for a vapor cell atomic frequency reference

Methods are provided for authenticating a value article that includes a luminescent material. An exciting light source, an optical filter, a photodetector, a signal manipulation circuit, and an amplifier are provided. The luminescent material is exposed to light produced by the exciting light source. Radiation including light from the exciting light source and emitted radiation from the luminescent material is filtered using the optical filter to produce filtered radiation. The filtered radiation is detected using the photodetector to produce a detected radiation signal. The detected radiation signal is electronically manipulated using the signal manipulation circuit to reduce an effect of light from the exciting light source on an authentication determination based upon the detected radiation signal. The detected radiation signal is amplified with the amplifier after electronic manipulation to produce an amplified electronic signal. The amplified electronic signal or data derived therefrom is converted to an authentication output.

Authentication systems, authentication devices, and methods for authenticating a value article

Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.

Self-destructing chip

A self destructing device includes: at least one active electronic region and at least one thermal destruction trigger; at least one chamber enclosed by the semiconducting material, wherein the at least one chamber contains an etchant material, wherein in response to activation of the at least one thermal destruction trigger, the self-destructing device is configured to: generate heat to cause decomposition of at least a first portion of the etchant material; decompose at least a first portion of the etchant material; etch at least a second portion of the second oxide layer provided between the semiconducting material and the at least one chamber at a first temperature; expose the etchant material to the semiconducting material to cause an exothermic reaction generating more heat; enable spread of the exothermic reaction to etch at least a third portion of the first oxide layer and to etch the top layer.

Self-destructing electronic device

In some examples, a controller is configured to generate a key based on a physics-based output of a component. The controller may, for example, use the key to authenticate communication between at least two nodes, to encrypt data, or to decrypt data. In some examples, the component includes one or more subcomponents, each subcomponent including a cell filled with a gas, a light source configured to transmit a light through the gas cell, and a photodetector configured to sense light transmitted through the gas cell. The photodetector of each subcomponent is configured to generate an electrical signal that changes as a function of one or more properties of the light sourced by the light source, transmitted through the gas cell. The output of the component can is based on the signals generate by the one or more photodetectors.

Physics-based authentication

Systems and methods for a wafer scale atomic clock are provided. In at least one embodiment, a wafer scale device comprises a first substrate; a cell layer joined to the first substrate, the cell layer comprising a plurality of hermetically isolated cells, wherein separate measurements are produced for each cell in the plurality of hermetically isolated cells; and a second substrate joined to the cell layer, wherein the first substrate and the second substrate comprise electronics to control the separate measurements, wherein the separate measurements are combined into a single measurement.

Systems and methods for a wafer scale atomic clock

In an example, a chip-scale atomic clock physics package is provided. The physics package includes a body defining a cavity having a base surface and one or more side walls. The cavity includes a first step surface and a second step surface defined in the one or more side walls. A first scaffold mounted to the base surface in the cavity. One or more spacers defining an aperture therethrough are mounted to the second step surface in the cavity. A second scaffold is mounted to a first surface of the one or more spacers spans across the aperture of the one or more spacers. A third scaffold is mounted to a second surface of the one or more spacers in the cavity and spans across the aperture of the one or more spacers. Other components of the physics package are mounted to the first, second, and third scaffold.

Vapor cell atomic clock physics package

A spectroscopic assembly is provided. The spectroscopic assembly includes a thermal isolation platform, a gas reference cell encasing a gas and attached to the thermal isolation platform, the gas reference cell having at least one optically-transparent window, and at least one heater configured to raise a temperature of the encased gas. When a beamsplitter is configured to reflect a portion of an input optical beam emitted by a laser to be incident on the at least one optically-transparent window of the gas reference cell, the reflected portion of the input optical beam is twice transmitted through the gas. When a detector is configured to receive the optical beam twice transmitted through the gas, a feedback signal is provided to the laser to stabilize the laser.

Simple, low power microsystem for saturation spectroscopy

In an example, a chip-scale atomic clock physics package is provided. This chip-scale atomic clock physics package includes a body defining a cavity, and a first scaffold mounted in the cavity. A laser is mounted on the first surface of the first scaffold. A second scaffold is also mounted in the cavity. The second scaffold is disposed such that the first surface of the second scaffold is facing the first scaffold. A first photodetector is mounted on the first surface of the second scaffold. A vapor cell is mounted on the first surface of the second scaffold. A waveplate is also included, wherein the laser, waveplate, first photodetector, and vapor cell are disposed such that a beam from the laser can propagate through the waveplate and the vapor cell and be detected by the first photodetector. A lid is also included for covering the cavity.

Systems, methods, and devices for receiving a differential input signal and generating a non-differential output signal are described herein. For example, an RF buffer is described that includes first and second transistor elements. The first transistor element receives a first polarity signal of a differential signal and drives a non-differential output of the RF buffer. A second transistor element receives a second polarity signal of the differential signal and drives the non-differential output of the RF buffer. The first and second transistor elements substantially simultaneously drive the non-differential output of the RF buffer.

Radio frequency buffer

Systems, methods, and devices provided herein are directed to improvements in gain control amplifiers that receive an input signal and generate an output signal with a selectively variable gain. A differential amplified gain stage receives an input signal and scales the input signal to generate a scaled signal. A gain adjust stage receives the scaled signal and an adjust signal and adjusts an amplitude of the scaled signal based on the adjust signal to generate an adjusted scaled signal. The adjusted scaled signal has a substantially constant impedance regardless of value of the adjust signal.

Gain control amplifier

A radiation sensor and a method for making the radiation sensor are described. An ionizing radiation sensitive area is formed in a radiation insensitive or hardened die. When the sensitive area is impacted by ionizing radiation, properties of the sensitive area change. For example, the changed property may be charge density, threshold voltage, leakage current, and/or resistance. Circuitry for measuring these property changes is located in a radiation hardened area of the die. As a result, a radiation sensor may be fabricated on a single die.

Passive solid state ionizing radiation sensor

A radiation hard design for oscillator circuits and circuits having differential outputs is described. The design includes connecting or otherwise coupling outputs of these circuits to a passive polyphase filter. The passive polyphase filter provides four quadrature outputs that are free of glitches that may have occurred at the filter input.

Growing community of inventors

Eden Prairie, MN, United States of America

Jeffrey James Kriz