Illinois Tool Works Inc.

Jeffrey J Tyrrell

Bradley Scott Withers

Bradley T Lyon

Karen F Bonnell

A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush including a first end, a second end opposed to the first end, an outer surface, and a hollow bore defined in the brush about a central axis of the brush. The brush defines a first cross-sectional area near the first end and a second cross-sectional area near the second end. Both the first and second cross-sectional areas are generally perpendicular to the central axis and the second cross-sectional area is greater than the first cross-sectional area.

Conical sponge brush for cleaning semiconductor wafers

A flat mop is used with a disposable wiper. The mop includes a base member having an upper surface and a lower surface. The base member has a projecting securing elements disposed on opposing sides of the upper surface. At least one resilient clip is associated with securing element. A pivot joint has a first receiving portion for mounting to the base member to define a first pivot axis. The pivot joint has a second receiving portion distinct from the first receiving portion and includes an engagement member received in the second receiving portion to defining a second pivot axis spaced from and perpendicular to the first pivot axis. The engagement member includes a coupling portion to mount to a handle. The pivot joint is mounted to the base member for pivoting the base member relative to the pivot joint about two axes. The associated wiper is secured to the base member, positioned on the lower surface of the base member, wrapped around the base member and over the securing elements. The clips are positioned over the associated wiper, on a respective one of the securing elements to secure the wiper to the base member.

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West Berlin, NJ, United States of America

Jeffrey J Tyrrell