Cool Shield, Inc.

Cool Options, Inc.

Jeffrey J Panek

Kevin A McCullough

E Mikhail Sagal

Peter D Tata

James Vernon Miller

James W Carpenter

A method for making a thermoplastic, thermally-conductive interface article is provided. The method used to make the interface article involves injection-molding a moldable composition into molding members. The moldable composition contains a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material. The thermally-conductive articles can be used as thermal interfaces to dissipate heat from heat-generating electronic devices.

Method for making thermoplastic thermally-conductive interface articles

The present invention discloses a thermal transfer interface having an integrally formed means for fastening and maintaining intimate thermal contact between a heat generating device and a heat-dissipating device. The interface of the present invention includes two components, a compressible thermal transfer component having a first thickness and an adhesive fastening component having a second thickness that is less than the first. The first component, the thermal transfer element, includes a base polymer matrix compound that is loaded with a thermally conducting filler that imparts thermally conductive properties to the net shape moldable material. The polymer base matrix is preferably a highly compressible material such as an elastomer. The second component of the present invention is a pressure sensitive adhesive component. The adhesive is applied adjacent to the thermal transfer element or in an alternating pattern throughout a base field of thermal transfer material. The adhesive component has a thickness that is less than the overall thickness of the thermal transfer material. When, the heat dissipating device with the present invention applied is pressed into contact with a heat generating surface the elastomer is compressed and maintained in the compressed state by the pressure sensitive adhesive material.

Structure and method of attaching a heat transfer part having a compressible interface

The present invention discloses a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed device. Further, a layer of thermally conductive pressure sensitive adhesive material is applied to the conformable interface surface to allow the device to be securely fastened to a heat-generating surface. The present invention provides superior sealing and elimination of voids and air gaps that are typically found between the thermal transfer surfaces thereby facilitating enhanced thermal transfer properties. In addition, the present invention provides a method of manufacturing an elastomeric heat sink device as described above.

Elastomeric heat sink with a pressure sensitive adhesive backing

The self-fastening handle assembly includes a carrier panel with an aperture. A base member has a central bore and a bottom surface. Fingers, which extend from the bottom surface of the base member, are in a first arrangement which has a diameter which is smaller than the diameter of the aperture and thereby capable of being routed therethrough. The fingers are expandable from the first arrangement to a second arrangement having a diameter greater than the diameter of the aperture. A spreader pin resides within the bore and within the fingers. The spreader pin is movable from a first position with the fingers at the first arrangement to a second position within the fingers to a second arrangement with the finger engaging surface in communication with the fingers. A handle, pivotally connected to the base member by a pivot; has an impact end which drives the spreader pin into the fingers upon rotation of the handle. As a result, the fingers spread on the opposing side of the carrier panel thus securing the base member and handle thereto.

Self-fastening handle assembly

The present invention relates to a method of manufacturing a thermally conductive article having an integrated thermally conductive surface. The method involves molding a first thermally conductive composition to form a body of the article and then molding a second thermally conductive composition to form an integrated surface on the body of the article. The integrated thermally conductive surface can interface with a heat-generating device (e.g., an electronic part) to dissipate heat from the device. The invention also encompasses thermally conductive articles produced by this method.

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N. Kingstown, RI, United States of America

Jeffrey J Panek