Taiwan Semiconductor Manufacturing Comp. Ltd.

Jeffrey Hsu

Pei-Haw Tsao

Chender Huang

Allan Lin

A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.

Growing community of inventors

Hsinchu, Taiwan

Jeffrey Hsu