Delphi Technologies, Inc.

Gm Global Technolgoy Operations, Inc.

Delco Electronics Corporation

Jeffrey H Burns

John Richard Troxell

Arun K Chaudhuri

Binghua Pan

Bruce Alan Myers

Alejandro Moreno

David Fredrick Reuter, Ii

Adil Ansari

Jerry Lee Newton

Hongzhi Kong

Qin Sun

Teck Tiong Tan

Raymundo Saenz

Jay P Johnson

Tecktiong Tan

Su Liang Chan

Richard Michael Parrott

An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.

Optical information processing circuit assembly

An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on the first substrate opposite the housing, and a chip on the second substrate. The first substrate defines a window aligned with the housing so that light traveling through the housing also passes through window. The second substrate defines an opening aligned with the window, and the chip is located over the opening in the second substrate so that a light-sensing element on the chip senses light passing through the opening. The module is equipped with features that prevent light from entering the module through the second substrate, the first substrate, and between the chip and second substrate.

Electronic module with light-blocking features

An object surface characterization system with adaptive lighting control includes a light projector, a light source, a camera, a processor and a memory subsystem. The processor is coupled to the light projector, the light source and the camera, as well as the memory subsystem. The memory subsystem stores code that, when executed by the processor, instructs the processor to perform a number of steps to achieve adaptive lighting control for the system.

Adaptive lighting control for vision-based occupant sensing

An encapsulation material suitable for dissipating heat generated by an electronic module, such as by directly contacting a heat-generating power device or contacting a heat sink of a heat-generating power device. The encapsulation material comprises phase change particles dispersed in a gel material. The phase change particles preferably comprise a solder alloy encapsulated by a dielectric coating so the phase change particles are electrically insulated from each other. The encapsulation material may further comprise dielectric particles dispersed in the gel material for the purpose of increasing the thermal conductivity of the encapsulation material. Alternatively or in addition, the dielectric coating on the phase change particles may comprise dielectric particles that are dispersed in a dielectric matrix, again with the preferred effect of increasing the thermal conductivity of the encapsulation material.

Thermally-capacitive phase change encapsulant for electronic devices

An electric motor and motor drive unit assembly includes a motor assembly having a housing and a motor rotatably coupled within the housing. A power distribution bus is coupled to the housing. The power distribution bus is coupled to an end cap of the motor. A plurality of semiconductor switches are coupled to the power distribution bus. The motor and drive assembly further includes a drive assembly having a case coupled to the power distribution bus. The case is electrically isolated from and is in thermal communication with the power distribution bus. The case has a plurality of openings therethrough. An interconnect circuit board is disposed within the case and is electrically coupled to the power distribution bus through the plurality of openings. A system control board is disposed within the case and is electrically coupled to the interconnect board.

Integrated motor and motor drive unit

A solenoid coil attachment mechanism includes a coil assembly with a wire end that projects from the coil assembly and an extending elongated leg that includes a latching mechanism. A carrier has a wall with an opening receiving the leg of the coil assembly and has a wire guide that is funnel shaped, has an open end and receives the end of the wire. A circuit board is attached to the carrier and the wire end is soldered directly to the circuit board.

Solenoid coil attachment mechanism

Growing community of inventors

Kokomo, IN, United States of America

Jeffrey H Burns