Hamilton Sundstrand Corporation

B/e Aerospace, Inc.

Jeffrey Ewanchuk

Brian St Rock

Suman Dwari

Ram Ranjan

Ross Keith Wilcoxon

Parag M Kshirsagar

Kimberly Rae Saviers

Sebastian Pedro Rosado

Karthik Debbadi

Baljit Singh Riar

Chi Zhang

Haley Steffen

A power converter includes a field graded substrate, a plurality of power device dies attached to the field graded substrate, a polymer layer on the field graded substrate, one or more conductors over the polymer layer, and a plurality of power conditioning components mounted on the field graded substrate to form a power converter circuit. The field graded substrate includes a first conductor layer, a graded layer that blends conductor and insulator material, and a second conductor layer, the graded layer having an insulator core.

Power converter

A power converter includes an amplifier, an inductor, a capacitor, and an interconnection block formed of an insulating material having conductive material deposited thereon by a multi-material printing process. The interconnection block supports one of the inductor and the capacitor in a manner that the one the inductor and the capacitor is disposed vertically above an other of the inductor and the capacitor.

Compact circuit devices using ceramic-copper layers based packaging

A system for cooling a power component includes a first metal layer. A cooling layer having a first surface is in contact with a surface of the first metal layer. A second metal layer is included having a surface in contact with a second surface of the cooling layer opposite the first metal layer. The cooling layer is of a material different from that of the first metal layer and that of the second metal layer. A plurality of cooling features are embedded in the material of the cooling layer. The cooling channels are spaced apart from both the first metal layer and the second metal layer by the material of the cooling layer. An electrically conductive path connects the first metal plate to the second metal plate.

Cooling in conductors for chips

A semiconductor device package includes a multilayer substrate including atop layer, a bottom layer and an intermediate layer between the top layer and the bottom layer. The package also includes one or more semiconductor dies embedded in the intermediate layer and conductive connector means to provide a conductive connection from the one or more dies. The conductive connector means extend through the top layer to provide connection means for one or more devices mounted on or adjacent the top layer.

Plurality of dies electrically connected to a printed circuit board by a clip

An apparatus for modular AC to AC frequency conversion is disclosed. An input AC source is configured to generate an input AC voltage at a first frequency. At least one primary low frequency (LF) conversion stage is configured to generate a DC voltage, and comprises a first pair of metal-oxide-semiconductor field effect transistors (MOSFETs). At least one primary high frequency (HF) conversion stage is configured to generate the DC voltage, and comprises a first pair of high electron mobility transistors (HEMTs). At least one secondary LF conversion stage is configured to receive the DC voltage and generate an output AC voltage at a second frequency, and comprises a second pair of MOSFETs. At least one secondary HF conversion stage is configured to receive the DC voltage and generate the output AC voltage at the second frequency, and comprises a second pair of HEMTs.

AC-to-AC power supplies using multi-frequency power conversion building blocks

System and methods for power conversion are provided. Aspects include a first switching module comprising a first set of switches, wherein the first set of switches comprise wide-bandgap devices having a first bandgap, a second switching module comprising a second set of switches, wherein the second set of switches comprise semiconductor devices having a second bandgap, and wherein the first bandgap is larger than the second bandgap, an alternating current (AC) power source connected to the first switching module and the second switching module, a first capacitor bank, a second capacitor bank, and a controller configured to operate the first switching module and the second switching module to create a first direct current (DC) voltage across the first capacitor bank and a second direct current (DC) voltage across the second capacitor bank.

Growing community of inventors

Manchester, CT, United States of America

Jeffrey Ewanchuk