Mitsubishi Electric Corporation

Mitsubishi Electric R&d Centre Europe B.v.

Jeffrey Ewanchuk

Stefan Mollov

Julio Brandelero

Nicolas Voyer

Roberto Mrad

Nicolas Degrenne

Jonathan Robinson

Nicolas Gresset

Julien Morand

Laurent Foube

Guillaume Lefevre

Remi Perrin

Rémi Perrin

Julio Cezar Brandelero

A device comprising a gate pad, a source pad and a passive actuator arranged to form a reversible mechanical and electrical connection between the gate pad and the source pad only if the temperature in the passive actuator exceeds a threshold value.

Device and method for manufacturing device

The invention: determines if the duration of the conducting state of the semiconductors in a first cycle of the pulse width modulation is upper than a predetermined duration, measures, during the conducting state of the semiconductors at a second cycle, the voltage provided to the load, sequentially disables the conduction of each semiconductor during a part of the duration of the conducting state of the semiconductors in a third cycle and measures the voltage provided to the load, determines the differences between the voltage measured during the second cycle and each voltage measured during the third cycle, orders the differences according to their value, checks if the determined order is identical to an order stored in a memory of the device and determines that one connection of one semiconductor is deteriorated if the order is changed.

Method and device for monitoring connection of semiconductor of power module

A method for determining the junction temperature of at least one die of a semiconductor power module, the semiconductor power module being composed of plural dies connected in parallel and switching between conducting and non conductor states according to pattern cycles, the method comprises the steps of: disabling the conducting of the at least one die during at least a fraction of one switching cycle, applying a current limited voltage to the gate of the at least one die during a period of time of the cycle wherein the at least one die is not conducting, the resulting voltage excursion having a value that does not enable the die to be conducting, measuring the voltage at the gate of the die, deriving from the measured voltage a temperature variation of the junction of the at least one die or the temperature of the junction of the die.

Method and device for determining junction temperature of die of semiconductor power module

A method and device for monitoring a multi-die power module in a half-bridge switch configuration are provided. The method and device are designed to set dies in a non conductive state, select one die which is blocking a voltage, inject a current in a gate of the selected die in order to charge an input parasitic capacitance of the selected die, monitor a voltage that is representative of a voltage on the gate of the selected die, and memorize the value of the monitored voltage when the value of the monitored voltage is stabilized.

Device and method for monitoring multi-die power module

The present invention concerns a method for controlling the temperature of a multi-die power module, a multi-die temperature control device. The multi-die temperature control: obtains a signal that is representative of the temperature of one die among the dies of the multi-die power module when the die is not conducting, obtains signals that are representative of a reference temperature that is dependent of the temperature of all the dies of the multi-die power module when the dies are not conducting, compares the signal that is representative of the temperature of one die to the signal that is representative of the reference temperature, reduces the duration of the conducting time of the die or reducing the duration of the conducting time of the other dies of the multi-die power module according to the comparison result.

Multi-die temperature control device and method for controlling temperature of multi-die power module

A device having at least one power semiconductor die coated with a metallization and at least one light guide having two opposite ends. The first end is able to be connected at least to a light source and to a light receiver. The second end is permanently fixed facing to a surface of the metallization such that to form a light path towards said surface and a light path from said surface.

Device and method for monitoring the health of a power semiconductor die

The present invention concerns a system for allowing the restoration of an interconnection of a die of a power module, a first terminal of the interconnection being fixed on the die and a second terminal of the interconnection being connected to an electric circuit. The system comprises:&#x2014;at least one material located in the vicinity of the first terminal of the interconnection, the material having a predetermined melting temperature,&#x2014;means for controlling the temperature of the die at the predetermined melting temperature during a predetermined period of time. The present invention concerns also the method.

System and method for allowing restoration of interconnection of die of power module

A power module () is disclosed, comprising:

Power module and method for manufacturing power module

The present invention concerns a power module comprising at least one power die, the at least one power die is embedded in a multilayer structure, the multilayer structure is an assembly of at least two sub-modules, each sub-module being formed of isolation and conductor layers and the power module further comprises at least one capacitor embedded in the multilayer structure for decoupling an electric power supply to the at least one power die embedded in the multilayer structure and at least one driving circuit of the at least one power die that is disposed on a surface of the multilayer structure or embedded completely or partially in the multilayer structure.

Power module having a multilayered structure with liquid cooled busbar and method for manufacturing same

The present invention concerns a system for allowing the restoration of a first interconnection of a die of a power module connecting the die to an electric circuit. The system comprises: at least one other interconnection of the power module, a periodic current source that is connected to the at least one other interconnection for generating a periodic current flow through the at least one other interconnection in order to reach, in at least a part of the first interconnection, a predetermined temperature during a predetermined time duration. The present invention concerns also the associated method.

System and method for allowing restoration of first interconnection of die of power module

The present invention concerns a system comprising at least one power module comprising at least one power die that is cooled by a liquid cooled system, the liquid cooled system is arranged to provide at least one electric potential to each power dies of the power module, characterized in that the liquid cooled system is composed of a first and a second current-carrying bars connected together by an electrically non-conductive pipe, the first bar is placed on the top of the power module and provides a first electric potential to the power die and the second bar is placed on the bottom of the power module and provides a second electric potential to the power dies and the liquid coolant is electrically conductive and the channels surfaces are covered by an electrical insulation layer.

System comprising at least one power module comprising at least one power die that is cooled by liquid cooled system

Method for controlling health of multi-die power module and multi-die health monitoring device

The present invention concerns a method for controlling the temperature of a multi-die power module, comprising:

Device and method for controlling temperature of multi-die power module

The present invention concerns a method for estimating a level of damage of an electric device. The method comprises the steps of: forming a histogram of operating cycles related to the electric device for which the level of damage estimation is performed, comparing the formed histogram to histograms of a collection of histograms or to combinations of histograms of the collection of histograms, each histogram of the collection of histogram being associated to a level of damage, in order to determine the histogram of the collection of histograms or the combination of histograms which is the closest from the formed histogram, determining an estimate of the level of damage of the electric device from the level of damage of the closest histogram or from the levels of damages of the histograms of the closest combination of histograms.

Method, device and system for estimating level of damage of electric device using histograms

The present invention concerns a device for controlling the operation of a power module composed of switches, each switch being composed of a plurality of power dies connected in parallel, characterized in that the device comprises, for each power die of the power module: &#x2014;a temperature sensor to sense the temperature of the power die, &#x2014;a current sensor to sense the current going through the power die, &#x2014;a gate interrupt circuit to interrupt the signal provided to the power die if the sensed current is higher than a predetermined current threshold, &#x2014;a controller to reduce the conducting time of the die if the sensed temperature of the power die is higher than the average die temperature across the power dies of at least one switch.

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Rennes, France

Jeffrey Ewanchuk