Lightwave Electronics Corporation

Lumileds LLC

Ipg Photonics Corporation

Koninklijke Philips Corporation N.v.

Philips Lumileds Lighting Company LLC

Philips Lighting Holding B.v.

Lumileds Holding B.v.

Lightwave Electronics Mountain View

Jeffrey Dellert Kmetec

Mark Alan Arbore

Oleg Borisovich Shchekin

Brendan Jude Moran

Thomas James Kane

Li Zhang

Grigoriy Basin

Jonathan S Ehrmann

Kuochou Tai

Alexey V Avdokhin

Franklin Joseph Wall

Andrei Babushkin

Yidong Zhou

Pancho Tzankov

Frederic Stephane Diana

Mina Farr

Alexander H Nickel

Wen Yu

Franklin J Wall, Jr

Mark W Byer

Serge Laurent Rudaz

William M Grossman

Frank J Adams

Mohiuddin Mala

Thomas R Myers

Franklin Wall, Jr

Joseph J Alonis

Charles C Harb

Iain Black

Werner H Wiechmann

Peter Stormberg

Richard S Kern

Manuel Martinez

Damon A Wheeler

Frans Maurits Vos

Hai-Linh K Nguyen

Gregory Guth

Robert Zona

Brian R Rankin

Cory Bowman

A multiple wavelength laser processing system is configured with a multiple wavelength laser source for generating a multiple wavelength coaxial laser processing beam. The laser processing system further includes a multiple wavelength optical system to deliver the coaxial laser processing beam to a laser-material interaction zone on the surface of a workpiece such that each of the a first and a second laser wavelengths in the processing beam impinge at least a portion of the interaction zone as respective first and second concentric laser spots. The multiple wavelength optical system includes a multiple wavelength beam collimator, a configurable chromatic optic, and a laser processing focus lens, wherein the configurable chromatic optic provides an adjustment to the relative focus distance of the first and second laser wavelengths.

System and method laser for processing of materials

A multiple wavelength laser processing system is configured with a multiple wavelength laser source for generating a multiple wavelength coaxial laser processing beam. The laser processing system further includes a multiple wavelength optical system to deliver the coaxial laser processing beam to a laser-material interaction zone on the surface of a workpiece such that each of the first and a second laser wavelengths in the processing beam impinge at least a portion of the interaction zone as respective first and second concentric laser spots. The multiple wavelength optical system includes a multiple wavelength beam collimator, a configurable chromatic optic, and a laser processing focus lens, wherein the configurable chromatic optic provides an adjustment to the relative focus distance of the first and second laser wavelengths.

A heatable element is configured to apply sufficient energy density to contaminants in an internal ambient atmosphere with in a sealable housing to drive a reaction that inactivates the contaminants.

High temperature optical molecular anti-contamination getter system

A structure according to embodiments of the invention includes a light emitting device for emitting light having a first peak wavelength. A wavelength converting layer is disposed in a path of light emitted by the light emitting device. The wavelength converting layer absorbs light emitted by the light emitting device and emits light having a second peak wavelength. The wavelength converting layer includes a mixture of a wavelength converting material, a transparent material, and an adhesive material, wherein the adhesive material is no more than 15% of the weight of the wavelength converting layer.

Wavelength converted semiconductor light emitting device

Light emitting die () comprising a plurality of light emitting elements (310A, 310B), each having a pair of bond pads (NPand NP), wherein at least two diagonally opposite bond pads of adjacent light emitting elements on a die have their facing corners truncated () to enable a direct diagonal coupling of a complementary pair of diagonally opposite bond pads when the die is monted on a substrate on which an interconnection pattern is formed. By enabling diagonal as well as lateral coupling of the bond pads of multiple light emitting elements of a die, the multiple light emitting elements may be arranged in a variety of series and/or parallel configurations, thereby facilitating the use of the same die at different nominal operating voltages with a single interconnect layer on the substrate upon which the die is mounted.

Die bond pad design to enable different electrical configurations

A lighting device including a body (). The body () includes a mounting area () with a plurality of conductive pads () and an elongate member () extending from the mounting area (). The mounting area () and the elongate member () are formed of a thermally conductive, electrically insulating material. The conductive pads () are embedded in the thermally conductive, electrically insulating material. The device further includes a semiconductor light emitting device () disposed in direct contact with the body () in the mounting area ().

Lighting device including a thermally conductive body and a semiconductor light emitting device

A mixing optic combines a variety of features to enhance the brightness and uniformity of the light emitted from a combination of different color light emitting sources. The mixing optic may include a parabolic reflector that redirects low-angle emissions, a reflective waveguide that mixes the light spatially, and a diffuser plate that mixes the light angularly. In an embodiment, the output of the mixing optic exhibits a substantially Lambertian output pattern of a substantially uniform mix of colors, exhibiting, for example, the light output pattern of a single white light source.

Color mixing output for high brightness LED sources

Proposed is a package () having at least two pins (). The package comprises a semiconductor structure () having a first function and an electrical circuit () comprising at least one circuit element having a second function. The structure () and the circuit () are electrically connected to the pins (). Moreover, the package is operable to perform the first and second function by time multiplexing a first () and second () operating signal through the pins (). Finally, the first function is a lighting function and the second function is a sensing function. The invention is especially advantageous as it provides a cost effective and versatile miniaturized light emitting package comprising LEDs or laser diodes.

Semiconductor package with incorporated light or temperature sensors and time multiplexing

A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer.

Highly reflective coating on LED submount

An illumination device includes a light source, such as one or more light emitting diodes and a wavelength converting element that is mounted on an opaque support structure. The support structure includes an aperture with which the wavelength converting element is aligned so that the converted light is emitted through the aperture. The wavelength converting element may be a rigid structure, such as a luminescent ceramic and the aperture may be a hole through the support structure. The support structure may hold the wavelength converting element so that it is physically separated from the light source, or alternatively, the support structure may place the wavelength converting element in physical contact with the light source.

Illumination device with a wavelength converting element held by a support structure having an aperture

Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.

Solderless integrated package connector and heat sink for LED

A split-band amplifying apparatus that has a first section for amplifying a long wavelength band of an optical signal and a second section equipped with a fiber amplifier for amplifying a short wavelength band of the optical signal. The fiber amplifier in the second section uses a short-pass fiber with a depressed cladding cross-section and core doped with an active material, e.g., Erbium, and pumped to a high relative inversion D. The split-band amplifying apparatus can be used to amplify signals whose short wavelength band includes at least a portion of the S-band and whose long wavelength band includes at least a portion of the C- and/or L-band.

Split-band amplifying apparatus using a depressed-profile fiber amplifier

A source that employs an Erbium-Doped Fiber Amplifier (EDFA) for generating light in an S-band of wavelengths. The EDFA uses a fiber having a core with a core cross section surrounded by a depressed cladding with a depressed cladding cross section and a secondary cladding with a secondary cladding cross section. A pump source is provided for pumping the Erbium contained in the core of the fiber to a high relative inversion D, such that the Erbium exhibits positive gains in the S-band and high gains in a long wavelength band longer than the S-band. The core cross-section, the depressed cladding cross-section, and the refractive indices n, n, and nare selected to produce losses at least comparable to the high gains in the long wavelength band and losses substantially smaller than the positive gains in the S-band. The source uses the amplified spontaneous emission (ASE) produced by the EDFA to generate broadband light and/or narrowband light with the aid of a wavelength selecting mechanism that selects an output wavelength of the light within the ASE emission spectrum of the EDFA.

S-band light sources using erbium-doped fiber with depressed cladding

A system and method for using pulses of laser light delivered in a non-overlapping sequence of first pulses at a green wavelength, second pulses at a blue wavelength and semi-continuous pulses at a red wavelength to illuminate a color generation unit for generating a color. Typically, the color generating unit is an image generating unit for producing color images and is equipped with transmissive or reflective pixels which are adjusted to select portions of the laser light generated at the green, blue and red wavelengths to obtain a desired output color. The first and second pulses preferably have a narrow pulse width and an interpulse separation equal to at least 100 times the narrow pulse width, while the semi-continuous pulses at the red wavelength have a wide pulse width equal to at least 100 times the narrow pulse width.

Pulse sequencing for generating a color image in laser-based display systems

Growing community of inventors

Palo Alto, CA, United States of America

Jeffrey Dellert Kmetec