International Business Machines Corporation

Other

Advanced Chemill Systems

Jeffrey D Jones

Robert H Katyl

Ronald J Moore

Steven L Bard

Thomas L Miller

Oscar A Moreno

Edward Jay Frankoski

Richard F Nelson

David D Hare

Fraser P Donlan, Jr

Lyn Braxton Ratcliff

Michael J Canestaro

James Steven Kamperman

Jack M McCreary

Gerald A Bendz

Michael S Horan

John R Chapura

John R Kjelgaard, Jr

An apparatus, and a corresponding method, for chemically etching the copper foil of a copper foil-clad substrate are disclosed. Significantly, this apparatus includes fluid jet injectors which serve to produce jets of chemical etchant. These fluid jet injectors are arranged so as to simultaneously achieve a relatively high etch rate and a relatively high etch uniformity.

Apparatus, and corresponding method, for chemically etching substrates

A method and apparatus are provided for the fine cleaning of a thin substrate. The apparatus has a transporter capable of moving the substrate through the apparatus by non-fluid contact with the edges of the substrate alone. In a typical embodiment, the transporter is a series of centrally-tapered rollers. As the substrate is moved through the apparatus by the transporter, its central section is supported by a fluid. Thus, the substrate moves through the apparatus without contact with any solid material except on its edges. As the substrate is moved through the apparatus by the transporter, fluid ejectors wash the substrate by spraying a cleaning fluid against the substrate. After being washed, the substrate is rinsed and then dried. Anti-dragout devices are positioned upstream and downstream of the washing and rinsing sections so as to minimize liquid dragout. The invention has been found very effective in cleaning thin sensitive substrates wherein physical contact with solid devices tends to contaminate the surface. The invention thoroughly cleans such thin substrates with little or no contamination. The invention has been shown to be effective at high throughputs.

Method and apparatus for cleaning thin substrates

An apparatus for chemically etching the copper foil of a copper foil-clad substrate are disclosed. Significantly, this apparatus includes fluid jet injectors which serve to produce jets of chemical etchant. These fluid jet injectors are arranged so as to simultaneously achieve a relatively high etch rate and a relatively high etch uniformity.

Apparatus for chemically etching substrates

A new method for treating substrates with fluids, as well as corresponding fluid treatment apparatus. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.

Method for fluid treating a substrate

A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.

Fluid treatment apparatus and method

A fluid treatment apparatus including a first fluid flow manifold having at least one fluid head positioned on a first side of a surface of a substrate to be treated by a fluid. The first fluid flow manifold includes at least two sets of a plurality of fluid jet injectors formed therein and apparatus for directing a fluid into the fluid jet injectors. Each of the fluid jet injectors creates a fluid jet impinging upon the surface of the substrate. Apparatus is interconnected with the first fluid flow manifold for supplying fluid to the fluid injector jets. Apparatus connected between the supply apparatus and the first fluid flow manifold alternates a flow of the fluid through the sets of fluid jet injectors. A fluid source is connected to the fluid supplying apparatus.

Apparatus and method for fluid processing of electronic packaging with

A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occurring within the same housing chamber which serves to collect the first fluid.

Fluid treatment apparatus

A fluid treatment apparatus and method wherein uniform treatment of a substrate (e.g., a thin, metallic sheet) is treated (e.g., etched) during movement thereof. This treatment involves directing a plurality of fluid jets through a collected first fluid onto one of the substrate's surfaces in such a manner that the fluid of each fluid jet will engage (collide with) the fluid from the nearest fluid jet as a result of being maintained across the substrate's surface at a predetermined velocity prior to mixing of the jets with surrounding fluid. Prevention of such mixing prior to such engagement has proven to assure uniform treatment of the substrate. In one aspect of the invention, fluid is directed onto opposite surfaces of the substrate in this fashion, the fluid from the lower surface, however, being passed through air or similar ambient and thus prevented from mixing therewith prior to such engagement.

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Newark Valley, NY, United States of America

Jeffrey D Jones