Globalfoundries Singapore Pte. Ltd.

Jeffrey Chor-Keung Lam

Zhihong Mai

Pik Kee Tan

Lei Zhu

Shyue Seng Tan

Lanxiang Wang

Yamin Huang

Tsu Hau Ng

Mohammed Khalid Bin Dawood

Meng Yew Seah

Huei Hao Yap

Dandan Wang

An integrated wafer probe card with a light source facing a device under test (DUT) side and enabling methodology are provided.

Wafer probe card integrated with a light source facing a device under test side and method of manufacturing

A method of forming a wedge-shaped fiber array and a bottom base according to a probing pad layout of a Si-Photonic device to enable optical, DC and RF mixed signal tests to be performed at the same time and the resulting device are provided. Embodiments include a bottom base; and a fiber array with sidewalls and a top surface having a first angle and a second angle, respectively, over the bottom base, wherein the fiber array is structured to expose bond pads of a Si-Photonic device during wafer level Si-Photonic testing.

Wedge-shaped fiber array on a silicon-photonic device and method for producing the same

A system for detection of a photon emission generate by a device of an integrated circuit, and methods for detecting the same are provided. The system includes a device space configured to include the device. The system further includes an electrical probe proximate the device space and configured to couple to the device. The electrical probe is configured to induce the device to generate the photon emission. The system further includes an optical fiber having a first end proximate the device space and a second end spaced from the first end. The first end is configured to receive the photon emission generated by the device. The optical fiber is configured to transmit the photon emission from the first end to the second end. The system further includes a detector in communication with the second end of the optical fiber and configured to detect the photon emission transmitted by the optical fiber.

System for detection of a photon emission generated by a device and methods for detecting the same

A multiple-sample-holder polishing setup for cross-section sample preparation and a method of making a device using the same are presented. The multiple-sample-holder polishing setup includes a frame. The frame has a hollow center, one or more long and short rods and a recess for accommodating a polishing head. The setup includes one or more sample holders. The sample holder is to be attached to the one or more long and short rods of the frame. A paddle is affixed to each sample holder. A sample is attached to the paddle. The sample is coated with a thin epoxy layer prior to polishing thereby allowing for easy inspection for site of interests as well as quick material removal.

Setup for multiple cross-section sample preparation

Growing community of inventors

Singapore, Singapore

Jeffrey Chor-Keung Lam