Intermolecular, Inc.

Jeffrey Chih-Hou Lowe

Robert Anthony Sculac

Sandeep Mariserla

Aaron T Francis

Satbir Kahlon

Gregory P Lim

Chi-I Lang

Frank C Ma

Wen-Guang Yu

Brian Kennedy Foster

A system and method for providing a plurality of diluted solutions are disclosed. Successive dilution operations are performed upon mixing vessels substantially simultaneously. Measured source volumes of a source solution are placed into the mixing vessels. First measured volumes of a liquid are added to the mixing vessels. Measured first waste volumes are dispensed from the mixing vessels. Second measured volumes of the liquid are added to the mixing vessels. Measured second waste volumes are dispensed from the mixing vessels. Third measured volumes of the liquid are added to the mixing vessels. Each vessel has an individual target dilution ratio. Measured volumes and number of dilution operations are individual to each of the mixing vessels.

High dilution ratio by successively preparing and diluting chemicals

Multiple waste streams, including incompatible chemicals such as concentrated acids and/or strong base effluents, are handled together without the need for limiting or interrupting the processes run by the wafer processing tools. In some embodiments, waste tanks are primed with diluents, such as water, and a predetermined percentage of diluent is maintained in the waste tanks. In some embodiments, a diluent is flowed into the waste tanks concurrently with the waste pumping to generate a rinsing action for the waste tanks. Methods of the present disclosure accommodate both gravity type and vacuum type waste tanks.

Effluent management, waste dilution, effluent pre-dilution, acid waste handling

Provided are methods and systems for dispensing different chemicals used for high productivity combinatorial processing. A dispense panel may include multiple inlet lines for supplying different chemicals. Each inlet line is connected to its own three-way valve that either allows the supplied chemical to flow from the inlet line towards a dispense valve connected to a dispense manifold (during dispensing of the supplied chemical) or allows another chemical to flow from the dispense valve to a waste manifold (during priming of the dispense manifold with this other chemical). Specifically, during priming a chemical supplied from its inlet line and is passed through a corresponding three-way valve and is directed to its dispense valve and then into the dispense manifold. Other dispense valves and three-way valves of the dispense panel allow this chemical to flow out of the dispense manifold, thereby priming remaining parts of the panel.

Methods and systems for dispensing different liquids for high productivity combinatorial processing

Methods for combinatorially processing semiconductor substrates are provided. The methods may involve receiving a substrate into a combinatorial processing chamber and sealing a plurality of flow cells against a surface of the substrate. The plurality of flow cells is enclosed within the combinatorial processing chamber to define an enclosed external environment for the plurality of flow cells. A pressure differential is created between a reaction area of the plurality of flow cells of the combinatorial processing chamber and the external environment, wherein each flow cells of the plurality of flow cells defines a site isolating region of the substrate. The regions the substrate are then combinatorially processed.

Reactor cell isolation using differential pressure in a combinatorial reactor

A method for combinatorially processing a substrate is provided. The method includes providing a substrate disposed on a substrate support. The substrate and the substrate support are raised against a plurality of sealing surfaces of corresponding sleeves of a plurality of flow cells of a combinatorial processing chamber. The combinatorial processing chamber is operable to concurrently process different regions of the substrate differently. A sealing pressure between the sealing surface of the sleeves and a surface of the substrate is monitored and the raising is terminated when a desired pressure is obtained. The different regions of the substrate are then processed differently.

Method and apparatus for controlling force between reactor and substrate

A method of calibrating a flow meter is provided. The method initiates with identifying a calibration fluid for a processing fluid. The calibration fluid has physical properties in common with the processing fluid with the exception of an outgassing characteristic. The method includes adding the calibration fluid to a vessel, where the vessel is in fluid communication with the flow meter and a withdrawal unit. The vessel is pressurized and the calibration fluid is withdrawn from the vessel through the flow meter and into the withdrawal unit, where the withdrawing performed by the withdrawal unit. A withdrawal volume per unit time measured by the flow meter is compared to a withdrawal volume per unit time controlled and set through the withdrawal unit.

Calibration procedure considering gas solubility

The embodiments describe methods for controlling the particles generated when cleaning and drying a wafer in a spin rinse dryer (SRD) module. In some embodiments, the substrate surface is cooled by dispensing deionized (DI) water across the surface of the substrate, while the substrate rests on the SRD chuck. In addition, a method for controlling the particles generated when sleeves in a processing module or SRD contact a substrate surface during a clamping operation or when the sleeves are removed from the substrate surface is provided. A bottom edge or lip of the sleeves and/or the surface of the wafer contacting the sleeve is wetted during clamping/unclamping operations. Alternatively, the substrate may be wetted prior to clamping/unclamping operations.

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Cupertino, CA, United States of America

Jeffrey Chih-Hou Lowe