California Micro Devices Corp.

Maspar Computer Corporation

Jeffrey C Kalb

Dominick L Richiuso

Jeffrey C Kalb, Jr

John C Jorgensen

Bhasker B Rao

Peruvamba Hariharan

John R Nickolls

Won Sub Kim

John Zapisek

W Thomas Blank

Anguel Svilenov Brankov

Kevin Van Horn

Gregg Duncan

John Dericourt Hurd

An active termination circuit for terminating a transmission line in bused or networked device, which might include a plurality of devices. The active termination circuit is configured to clamp a voltage level on the transmission line to one of a first reference voltage level and a second reference voltage level. The active termination circuit includes a first clamping transistor coupled to a transmission line terminal and a first terminal. The transmission line terminal is configured to be coupled to the transmission line in the electronic device. The first terminal is configured to be coupled to the first reference voltage level in the electronic device. There is included a second clamping transistor coupled to the transmission line terminal and a second terminal. The second terminal is configured to be coupled to the second reference voltage level in the electronic device. There is also included a first threshold reference device coupled to the first clamping transistor. The first threshold reference device being configured to maintain a base of the first clamping transistor at about V,lower than the second reference voltage level. There is further included a second threshold reference device coupled to the second clamping transistor, the second threshold reference device being configured to maintain a base of the second clamping transistor at about V,higher than the first reference voltage level.

Termination circuits and methods for bused and networked devices

The present invention relates, in one embodiment, to an integrated circuit including a first circuit structure, a first conductive bonding pad coupled to the first circuit structure, a second circuit structure, and a second conductive bonding pad coupled to the second circuit structure. The first conductive bonding pad is arranged to be separated from the second bonding pad by a gap having a gap dimension. The gap dimension is configured to be bridged by a wire bond, thereby permitting the wire bond to electrically couple the first conductive bonding pad with the second conductive bonding pad when the wire bond is coupled to the first bonding pad and the second bonding pad at the gap.

Integrated circuit structures and methods to facilitate accurate measurement of the IC devices

A thin film protected capacitor structure having a thin film capacitor and a protection device is provided on an integrated circuit wafer. The wafer has a low resistivity substrate of a first type disposed under an epitaxial layer of a second type different from the first type. The structure includes a first heavily doped region, which is of the first type, in and through the epitaxial layer, and an oxide layer having a first oxide region disposed above the first heavily doped region. The first heavily doped region and the low resistivity substrate form the first plate of the thin film capacitor. There is also included a metal layer disposed above the first oxide region. A portion of this metal layer forms the second plate of the thin film capacitor. Between the second plate and the first plate, the aforementioned first oxide region represents the insulating dielectric. There is also included a second heavily doped region in the epitaxial layer. This second heavily doped region, being of the first type and in electrical contact with the metal layer, has a thickness that is less than the thickness of the epitaxial layer. The protection device is formed from this second heavily doped region, the epitaxial layer, and the low resistivity substrate.

Integrated RC filters

An active termination circuit for terminating a transmission line in memory bus, which might include a plurality of devices. The active termination circuit is configured to clamp a voltage level on the transmission line to one of a first reference voltage level and a second reference voltage level. The active termination circuit includes a first clamping transistor coupled to a transmission line terminal and a first terminal. The transmission line terminal is configured to be coupled to the transmission line in the electronic device. The first terminal is configured to be coupled to the first reference voltage level in the electronic device. There is included a second clamping transistor coupled to the transmission line terminal and a second terminal. The second terminal is configured to be coupled to the second reference voltage level in the electronic device. There is also included a first threshold reference device coupled to the first clamping transistor. The first threshold reference device being configured to maintain a base of the first clamping transistor at about V.sub.BE lower than the second reference voltage level. There is further included a second threshold reference device coupled to the second clamping transistor, the second threshold reference device being configured to maintain a base of the second clamping transistor at about V.sub.BE higher than the first reference voltage level.

Termination circuits and methods for memory buses and devices

An active termination circuit for terminating a transmission line in an electronic device. The active termination circuit is configured to clamp a voltage level on the transmission line to one of a first reference voltage level and a second reference voltage level. The active termination circuit includes a first clamping transistor coupled to a transmission line terminal and a first terminal. The transmission line terminal is configured to be coupled to the transmission line in the electronic device. The first terminal is configured to be coupled to the first reference voltage level in the electronic device. There is included a second clamping transistor coupled to the transmission line terminal and a second terminal. The second terminal is configured to be coupled to the second reference voltage level in the electronic device. There is also included a first threshold reference device coupled to the first clamping transistor. The first threshold reference device being configured to maintain a base of the first clamping transistor at about V.sub.BE lower than the second reference voltage level. There is further included a second threshold reference device coupled to the second clamping transistor, the second threshold reference device being configured to maintain a base of the second clamping transistor at about V.sub.BE higher than the first reference voltage level.

Termination circuits and methods therefor

A Quarter Size Small Outline Packages (QSOP) integrated resistor/capacitor network. The QSOP integrated resistor/capacitor network includes resistor/capacitor filters implemented in a QSOP package in integrated form. In one embodiment, the QSOP integrated resistor/capacitor network includes at least six ground pins for coupling capacitors of the resistor/capacitor filters with a common ground to maximize the attenuation of ultra-high frequency signals filtered through the resistor/capacitor filters.

Methods and apparatus for improving frequency response of integrated RC

ESD-protected thin film capacitor structures

An integrated circuit for implementing a resistor network on a die of the integrated circuit. The integrated circuit includes a common conductor, which is disposed on a first side of the die and coupled to resistors of the resistor network. The integrated circuit further includes a substantially conductive substrate through the die. There is further included a conductive back side contact coupled to the substantially conductive substrate. The conductive back side contact is disposed on a second side of the die opposite the first side, whereby the common conductor, the substantially conductive substrate, and the conductive back side contact form a common conducting bus from the common conductor to the conductive back side contact through the die.

Integrated resistor networks having reduced cross talk

A massively parallel computer system is disclosed having a global router network in which pipeline registers are spatially distributed to increase the messaging speed of the global router network. The global router network includes an expansion tap for processor to I/O messaging so that I/O messaging bandwidth matches interprocessor messaging bandwidth. A route-opening message packet includes protocol bits which are treated homogeneously with steering bits. The route-opening packet further includes redundant address bits for imparting a multiple-crossbars personality to router chips within the global router network. A structure and method for spatially supporting the processors of the massively parallel system and the global router network are also disclosed.

Growing community of inventors

Saratoga, CA, United States of America

Jeffrey C Kalb