Fujifilm Corporation

Fujifilm Dimatix, Inc.

Apple Inc.

Dimatix, Inc.

Fujifilm Diamatix, Inc.

Jeffrey Birkmeyer

Andreas Bibl

Youming Li

John A Higginson

Zhenfang Chen

Paul A Hoisington

Mats G Ottosson

Yoshikazu Hishinuma

Gregory De Brabander

Yoshimasa Okamura

Takamichi Fujii

Takayuki Naono

Dariusz Golda

Shinya Sugimoto

Mark Nepomnishy

Stephen Paul Bathurst

Stephen R Deming

Arman Hajati

Kevin Von Essen

Deane Gardner

Darren Todd Imai

Gregory DeBrabander

Michael J Rocchio

Steve Deming

Daniel Alan West

Deane A Gardner

Michael Rocchio

Danielalan West

Gregory De Branbander

A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.

Compliant electrostatic transfer head with defined cavity

A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.

Compliant electrostatic transfer head with spring support layer

Processes for forming an actuator having a curved piezoelectric membrane are disclosed. The processes utilize a profile-transferring substrate having a curved surface surrounded by a planar surface to form the curved piezoelectric membrane. The piezoelectric material used for the piezoelectric actuator is deposited on at least the curved surface of the profile-transferring substrate before the profile-transferring substrate is removed from the underside of the curved piezoelectric membrane. The resulting curved piezoelectric membrane includes grain structures that are columnar and aligned, and all or substantially all of the columnar grains are locally perpendicular to the curved surface of the piezoelectric membrane.

Forming a device having a curved piezoelectric membrane

A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, and a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, and a heater to heat the substrate supported on the chuck. The chuck includes a body and a graphite heat diffuser supported on the body and configured to contact the substrate.

Physical vapor deposition with heat diffuser

Piezoelectric material is shaped by plasma etching to form deep features with high aspect ratios, and desired geometries.

Etching piezoelectric material

An ink jet printhead includes: a nozzle plate having an underside and including one or more nozzles in the underside configured to dispense drops of fluid in a dispensing direction; and a multi-level maintenance structure coupled to the nozzle plate such that a gap exists between a portion of the maintenance structure and the underside of the nozzle plate. The maintenance structure includes: a first portion having a first upper surface suspended at a first distance from the underside of the nozzle plate; and a second portion that is coupled to the first portion, the second portion having a second upper surface suspended at a second distance from the underside of the nozzle plate, which is greater than the first distance, the second upper surface laterally displaced relative to the first upper surface.

Nozzle plate maintenance for fluid ejection devices

A method of forming an actuator includes depositing a photoimageable material to form a first photoimageable layer on a piezoelectric layer; patterning the first photoimageable layer to form an aperture; and disposing a first conductive layer on the first photoimageable layer. An actuator device formed by this method includes the photoimageable material. The first conductive layer partially overlies the first photoimageable layer such that a first portion of the first conductive layer contacts the first photoimageable layer and a second portion of the first conductive layer electrically contacts the piezoelectric layer in the aperture.

Actuators and methods of making the same

An inkjet device includes a pumping chamber bounded by a wall, a piezoelectric layer disposed above the pumping chamber, a ring electrode having an annular lower portion disposed on the piezoelectric layer. A moisture barrier layer covers a remainder of the piezoelectric layer over the pumping chamber that is not covered by the annular lower portion of the ring electrode.

Passivation of ring electrodes

A method of physical vapor deposition includes applying a first radio frequency signal having a first phase to a cathode in a physical vapor deposition apparatus, wherein the cathode includes a sputtering target, applying a second radio frequency signal having a second phase to a chuck in the physical vapor deposition apparatus, wherein the chuck supports a substrate, and wherein a difference between the first and second phases creates a positive self bias direct current voltage on the substrate, and depositing a material from the sputtering target onto the substrate.

Physical vapor deposition with phase shift

A method of physical vapor deposition includes applying a radio frequency signal to a cathode in a physical vapor deposition apparatus, wherein the cathode includes a sputtering target, electrically connecting a chuck in the physical vapor deposition apparatus to an impedance matching network, wherein the chuck supports a substrate, and wherein the impedance matching network includes at least one capacitor, and depositing material from the sputtering target onto the substrate.

Physical vapor deposition with impedance matching network

A fluid ejector having an inner surface, an outer surface, and an orifice that allows fluid in contact with the inner surface to be ejected. The fluid ejector has a non-wetting monolayer covering at least a portion of the outer surface of the fluid ejector and surrounding an orifice in the fluid ejector. Fabrication of the non-wetting monolayer can include removing a non-wetting monolayer from a second region of a fluid ejector while leaving the non-wetting monolayer on a first region surrounding an orifice in the fluid ejector, or protecting a second region of a fluid ejector from having a non-wetting monolayer formed thereon, wherein the second region does not include a first region surrounding the orifice in the fluid ejector.

Non-wetting coating on a fluid ejector

Piezoelectric actuators having a composition of Pb(ZrTi)ONb, where x&#x3e;&#x2212;0.02 and y&#x3e;0 are described. The piezoelectric material can have a Perovskite, which can enable good bending action when a bias is applied across the actuator.

Sputtered piezoelectric material

A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, a clamp configured to hold the substrate to the chuck, wherein the clamp is electrically conductive, and a plurality of conductive electrodes attached to the clamp, each electrode configured to compress when contacted by the substrate.

Growing community of inventors

San Jose, CA, United States of America

Jeffrey Birkmeyer