International Business Machines Corporation

Bae Systems Information and Electronic Systems Integration Inc.

Jeffrey Alan Zimmerman

Donald Seton Farquhar

Lisa Jeanine Jimarez

Michael Joseph Klodowski

David L Questad

James Warren Wilson

Charles Robert Davis

John A Welsh

Stephen Joseph Fuerniss

Richard J Ferguson

Darbha Suryanarayana

Landon J Caley

Douglas E Chrzanowski

A method for modifying a portion of a substrate after production is described herein. The method can include diagnosing a circuit operation error causing a malfunction, identifying a first contact on the substrate, and connecting, electrically, the first contact to a second contact with at least one trace. The trace is done with a focused ion beam. The method can include diagnosing an error on an operative area of a post-manufacture circuit board causing a malfunction; introducing a metal precursor into a focused ion beam chamber; ionizing the metal precursor by contacting it with a gallium ion beam into a conductive metal and a further ion; depositing a first portion of a conductive metal onto a substrate to form a first trace; and forming the first trace between the operative area and a non-operative area thereby connecting the operative area and the non-operative area.

Post-production substrate modification with FIB deposition

An integrated circuit chip carrier assembly is provided by joining a substrate having electrically conductive regions on at least one major surface thereof to a stiffener by a bonding film. The bonding film comprises a dielectric substrate having a thermoset adhesive on both of its major surfaces. The thermoset adhesive prior to the bonding is a B-stage adhesive, is tack-free at normal room temperatures and is solvent free.

Integrated circuit chip carrier assembly

A process and apparatus are described for wire bonding circuit pads of large scale integrated design. The bonding process employs a capillary tool that applies heat and pressure to the wires in order to bond them to the circuit pad. The circuit pad is supported upon a closed woven, fiberglass mesh, which supports the circuit pad during the bonding process.

Wire bonding method and apparatus

Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate

Reinforcement members are disposed along only the transverse edge regions of selected flexible cables of an integral chip carrier and cable assembly, and along only the respectively aligned end areas of the chip carrier portion of the assembly. The reinforcement members may be disposed along all of the flexible cables and end areas of the assembly, or on only selected cable and end area portions of the assembly. The reinforcement members are formed of a tough tear resistant polymer material, such as a hot melt adhesive or polymer tape or film.

Chip carrier and cable assembly reinforced at edges

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Manassas, VA, United States of America

Jeffrey Alan Zimmerman