Amkor Technology, Inc.

Motorola Corporation

Texas Instruments Corporation

Jeffrey Alan Miks

Curtis Michael Zwenger

John Armando Miranda

Dwight L Daniels

Dilip D Patel

Markus K Liebhard

Kenneth Kaskoun

Stephen Gregory Shermer

Maximilien d'Estries

Paul Robert Hoffman

Donald Craig Foster

Ludovico Estrada Bancod

Ronald James Schoonejongen

Frederic Bertholio

Brenda Gogue

Mahmoud Dreiza

Sean Timothy Crowley

Barry M Miles

Bradley Morgan Haskett

Lee John Smith

John Patrick O'Connor

David T Roman

Jui Min Lim

Louis B Troche, Jr

August Joseph Miller, Jr

Mark Myron Miller

Christopher Scanlan

Mark Phillip Popovich

Ziehl-Neelsen L Co

Jung Chun Shis

Stephen C St Germain

A memory card comprising a flexible substrate (a 'flex') which is integrated in the memory card and folded in a prescribed manner subsequent to having various active and passive devices (e.g., controller and memory devices) surface mounted thereto. The active and passive devices are attached to a common side of the flex, and electrically connected to a conductive pattern disposed thereon. The conductive pattern itself electrically communicates with external signal contacts also formed on the flex. The use of folded flex technology in the memory card of the present invention allows the same to support four or more standard, pre-packaged memory devices, thus providing the memory card with substantially increased capacity.

High density memory card using folded flex

A top port MEMS package includes a substrate and an interposer mounted to the substrate. The interposer includes an interposer aperture and an interposer channel fluidly coupled to the interposer aperture. A MEMS electronic component is mounted to the interposer above the interposer aperture. A top port lid includes a top port and a chimney structure fluidly coupling to the top port to the interposer channel. A front volume including the top port, the flue, the interposer channel, and the interposer aperture is acoustically sealed from a relatively large back volume defined by a lid cavity of the top port lid. By acoustically sealing the front volume from the back volume and further by maximizing the back volume, the noise to signal ratio is minimized thus maximizing the sensitivity of top port MEMS microphone package as well as the range of applications.

Top port with interposer MEMS microphone package and method

According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.

Micro-optical device packaging system

A semiconductor device has a substrate. A die is attached to a first surface of the substrate. A heat sink is provided having an approximately planer member and support members extending from the planer member. The support members are attached to the first surface of the substrate to form a cavity over the die with the planer member positioned above the die. An encapsulant is provided for encapsulating the device, wherein an exterior surface of the planer member is exposed. A non-tapered opening is formed in the planer member. The encapsulant is injected through the opening to encapsulate the cavity and the encapsulant will partially fill the non-tapered opening.

Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate

A thermal via heat spreader package includes an electronic component having an active surface including a nonfunctional region. A package body encloses the electronic component, the package body comprising a principal surface. Thermal vias extend from the principal surface through at least a portion of the package body and towards the nonfunctional region. A heat spreader is thermally connected to the thermal vias. Heat generated by the electronic component is dissipated to the thermal vias and to the heat spreader. The density of the thermal vias is increased in a hotspot of the electronic component thus maximizing heat transfer from the hotspot. In this manner, optimal heat transfer from the electronic component is achieved.

Thermal via heat spreader package and method

A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the dambar by at least one tie bar. A layer of tape is applied to the leadframe such that the tape the bottom contact surfaces of the contacts, at least portions of the bottom dambar surface of the dambar. Thereafter, the tie bars are removed from the leadframe. At least one semiconductor die is electrically connected to the leadframe, with a body thereafter being formed on the leadframe such that the bottom contact surfaces are exposed in an exterior surface thereof.

Tape supported memory card leadframe structure

A memory card comprising a leadframe having a plurality of contacts, at least one die pad, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. Also included in the leadframe are at least two bumpers. Attached to the die pad is a semiconductor die which is electrically connected to at least one of the traces. A body defining at least two corner regions at least partially encapsulates the leadframe and the semiconductor die such that the contacts are exposed in a bottom surface defined by the body, and the bumpers are located at respective ones of the corner regions thereof.

Drop resistant bumpers for fully molded memory cards

A memory card comprising a substrate which has a plurality of contacts, at least one die pad, and a plurality of traces. The contacts, the die pad and the traces are disposed in spaced relation to each other and each define opposed first and second surfaces. Mounted to the first surface of the die pad is at least one electronic component which is electrically connected to at least one of the contacts either directly or via one or more of the traces. A first encapsulation part covers the second surfaces of the die pad and the traces, with the second surfaces of the contacts being exposed in the first encapsulation part. A second encapsulation part covers the electronic component and the first surfaces of the die pad, the contacts, and the traces. The first and second encapsulation parts collectively define a body of the memory card which includes a bottom surface having the second surfaces of the contacts exposed therein.

Secure digital memory card using land grid array structure

A circuit module for use in a memory card. The circuit module comprises a base substrate including a plurality of contacts. Attached to the base substrate is a memory die, while attached to the memory die is an interposer having a plurality of terminals electrically connected to each other in a prescribed pattern. At least one of the terminals is electrically connected to at least one of the contacts. Attached to the interposer is a controller die, with the memory die and the controller die each being electrically connected to at least one of the terminals of the interposer.

Interposer for interconnecting components in a memory card

A memory card comprising a substrate which has a plurality of contacts and a plurality of metal features. The contacts and the metal features are disposed in spaced relation to each other and each define opposed first and second surfaces. Mounted to the substrate is at least one electronic component which is electrically connected thereto. A body covers the electronic component and at least portions of the contacts and the metal features such that the second surfaces of the contacts and the metal features are exposed in a common exterior surface of the body.

A memory card comprising a leadframe having a die pad, and an insert having a plurality of contacts. Attached to the die pad is a semiconductor die which is electrically connected to the contacts of the insert. A body covers the die pad and the semiconductor die and partially covers the insert such that the contacts are exposed in an exterior surface of the body.

Memory card ESC substrate insert

A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

Lead-frame method and assembly for interconnecting circuits within a circuit module

A multi use circuit module has a front half module. The front half module is a functional circuit module having electrical contacts on a front portion there of for electrically coupling the multi use circuit module to a host device. A rear half module is removably coupled to the front half module. The rear half module increases functionality of the multi use circuit module by allowing functional and non functional components to be coupled to the front half module.

Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor

A semiconductor package comprising a substrate which includes a leadframe having a plurality of leads which each define opposed top and bottom surfaces and extends in spaced relation to each other such that gaps are defined therebetween. The substrate further comprises a compound layer which is filled within the gaps defined between the leads. The substrate includes a continuous, generally planar top surface collectively defined by the top surfaces of the leads and compound layer, and a continuous, generally planar bottom surface collectively defined by the bottom surfaces of the leads and compound layer. Attached to the top surface is a semiconductor die which is electrically connected to at least some of the leads.

Growing community of inventors

Chandler, AZ, United States of America

Jeffrey Alan Miks