International Business Machines Corporation

Jeffrey Alan Kash

Daniel Ray Knebel

James C Tsang

Bardia Pezeshki

Jeannine Madelyn Trewhella

Franklin F Tong

James Chen-Hsiang Tsang

Russell Alan Budd

Michael R Tan

Jeremy Daniel Schaub

Phillip J Nigh

Gary W Rubloff

Russell W Dreyfus

Pia Naoko Sanda

Johannes G Beha

Punit P Chiniwalla

Richard James Evans

John Andrew Guckenberger

Garry Trott

John Ulrich Knickerbocker

Casimer M DeCusatis

Alexander V Rylyakov

Clint Lee Schow

Steven Paul Ostrander

Benjamin G Lee

David P Vallett

Ronald Pete Luijten

Laurent Schares

Jeffrey John Welser

William T Devine

David F Heidel

John D Crow

Thomas F Kuech

Farid Agahi

Jean M Trewhella

David W Kisker

David P Vallet

James Chen Hsiang Tsang

A method and structure for a modulator which includes a forward-biased diode optimized for power and area to perform a tuning function, and a reverse-biased diode optimized for speed to perform a modulation function.

Photonic modulator with forward-and reverse-biased diodes for separate tuning and modulating elements

According to an embodiment of the present disclosure, a bidirectional communications system includes a first non-blocking network including a bidirectional optical switch, a plurality of nodes, a plurality of optical transceivers connected between the bidirectional optical switch and the plurality of nodes, each optical transceiver including a transmitter, a receiver and an optical combiner, and a second network connected to at least one of the nodes and the at least one at least one bidirectional optical switch for control of a crossconnect.

Method and apparatus for implementing non-blocking computer interconnection network using bidirectional optical switch

For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or mapping of a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array.

Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array

An integrated circuit and method are provided for preventing reverse engineering by monitoring light emissions emitted from transistors and such electrically active devices in the integrated circuit. The method prevents, in an integrated circuit, a pattern of light emitted from at least one active device in the integrated circuit from being detected external to the integrated circuit by fading the light emitted from the at least one active device in the integrated circuit and that is emitted external to the integrated circuit. Bright light emission emitted in substantial close proximity to the at least one active device in the integrated circuit, and emitted external to the integrated circuit, fades a pattern of light emission emitted from the at least one active device.

Device for defeating reverse engineering of integrated circuits by optical means

An integrated circuit and method are provided for preventing reverse engineering by monitoring light emissions emitted from transistors and such electrically active devices in the integrated circuit. The method prevents, in an integrated circuit, a pattern of light emitted from at least one active device in the integrated circuit from being detected external to the integrated circuit by reduction of the intensity of light emitted from the at least one active device in the integrated circuit thereby preventing the reduced intensity light emitted from the at least one active device in the integrated circuit from being detected external to the integrated circuit. The intensity of light emitted from the at least one active device in the integrated circuit can be reduced by modification of operational characteristics of the at least one active device during switching transitions.

An integrated circuit and method are provided for preventing reverse engineering by monitoring light emissions emitted from transistors and such electrically active devices in the integrated circuit. The method prevents, in an integrated circuit, a pattern of light emitted from at least one active device in the integrated circuit from being detected external to the integrated circuit by randomizing a pattern of light emitted from the at least one active device in an integrated circuit and that is emitted external to the integrated circuit. The pattern of light emitted from the at least one active device in the integrated circuit and that is emitted external to the integrated circuit can be randomized by randomizing a clock signal applied to a clocked circuit comprising the at least one active device in the integrated circuit.

A method for an electronic device is provided for preventing reverse engineering by monitoring light emissions emitted from transistors and such electrically active devices in the electronic device. The method emits extraneous randomized light emissions in substantial close proximity to the transistors to hide a pattern of light emissions emitted from the transistors. As one feature, the device can include a source of randomized light emissions in substantial close proximity to the transistors to hide a pattern of the emitted light from the transistors in randomized light emissions emitted by the source. As a second feature, the device can emit the randomized light emissions by randomly delaying an electrical signal that is electrically coupled to the transistors and, in response to the randomly delayed electrical signal, the transistors randomly emitting light emissions thereby hiding a separate pattern of light emission emitted from the transistors.

Method for defeating reverse engineering of integrated circuits by optical means

An integrated circuit chip (IC) is equipped with a device for preventing reverse engineering by monitoring light emissions emitted from transistors and such electrically active devices in a circuit located in the IC. The device emits extraneous randomized light emissions in substantial close proximity to the transistors to hide a pattern of light emissions emitted from the transistors. As one feature, the device can include a source of randomized light emissions in substantial close proximity to the transistors to hide a pattern of the emitted light from the transistors in randomized light emissions emitted by the source. As a second feature, the device can emit the randomized light emissions by randomly delaying an electrical signal that is electrically coupled to the transistors and, in response to the randomly delayed electrical signal, the transistors randomly emitting light emissions thereby hiding a separate pattern of light emission emitted from the transistors.

An integrated circuit chip (IC) is equipped with a device for preventing reverse engineering by monitoring light emissions emitted from transistors and such electrically active devices in a circuit located in the IC. The device can be an opaque structure that blocks emissions from being detected external to the IC. Alternatively, the device can reduce light emissions from the transistors to prevent detection of the light emissions external to the IC. The device, in another alternative, can emit extraneous light emissions to hide a pattern of light emissions emitted from the transistors. As a further alternative, the device can add random delay to a signal driving the transistors to randomize the pattern of light emissions emitted from the transistors to prevent detection of a predetermined pattern of light emissions external to the IC.

An embodiment of the invention is an optical interconnect module comprising a silicon carrier; a communication integrated circuit mounted on the silicon carrier and an optical integrated circuit flip chip mounted on the silicon carrier. The optical integrated circuit is in electrical communication with the communication integrated circuit by electrical paths in the silicon carrier. Optical paths in the silicon carrier provide optical coupling between the optical integrated circuit and an optical link.

Silicon carrier for optical interconnect modules

A redundant configurable VCSEL laser array optical light source which provides for integrating optical communications capabilities into manufacturing processes for a substrate or submount such as a silicon or ceramic substrate, a multi-chip module, a package board, backplane or similar component. Multiple, spatially proximate lasers and photodetectors are provided as part of an optical transmitter or receiver module to simplify assembly of the module, particularly alignment of a laser or photodetector to an optical fiber or waveguide. A feedback loop and control logic select those laser(s) or photodiodes(s) which are most strongly coupled to the transmission medium to produce the best signals. This approach greatly simplifies optical alignment, to improve yield and relax mechanical tolerances, leading to lower assembly costs and higher manufacturing yields.

Redundant configurable VCSEL laser array optical light source

A method and system for testing an integrated circuit. The method comprises the steps of obtaining periodic optical emissions over a defined period of time and from a defined area of an integrated circuit operating with time-varying internal currents, and time resolving said emissions by photon timing to estimate the number of switching events occurring in said defined area over said defined period. The method further comprises the steps of providing an optical emission model, and comparing the optical emissions from the area of the integrated circuit with the optical emission model to determine whether any of a group of defined conditions are present on the integrated circuit. For example, this test may be used to detect local power supply loading under high power density operation, or to derive changes in mobility due to heating effects.

Noninvasive optical method and system for inspecting or testing CMOS circuits

A method of and apparatus ( ) for detecting one or more defects ( ) in a plurality of chips ( ) on a wafer ( ). The method comprises a first step of simultaneously providing electrical power to the plurality of chips, thereby generating one or more light signals ( ) corresponding to the one or more defects in the plurality of chips. The second step is simultaneously forming an image ( ) of the plurality of chips so as to simultaneously detect the one or more light signals. The apparatus ( ) for carrying out the method comprises electrical probes ( ) for providing electrical power to the plurality of chips, a detector ( ) to detect the one or more light signals emitted by the chips as a result of electrical power interacting with the one or more defects, and an imaging system ( ) arranged so as to form an image of the plurality of chips, including the light signals, onto the detection surface ( ).

Integrated circuit device defect detection method and apparatus employing light emission imaging

A system and method for determining the location of a particular device on an integrated circuit chip is described. The system and method utilize apparatus for detecting the emission of light during switching events of devices in the circuit during the circuit's processing of an input calculated to actuate the device whose location is desired. Light emissions from the circuit can be temporally and spatially indexed so as to allow deduction, in combination with the a priori knowledge of the logical operation of the circuit, of the location of the desired element. In another embodiment of the invention, a series of images of the circuit can be accumulated, representing the circuit's response to a series of different input signals, each input signal being designed to result in the switching of the desired element. The series of images can be compared to determine the location of the desired element. Also in accordance with the invention, the elements to be located can be either actual functional circuit elements, or fiducials added to the chip for test purposes.

Growing community of inventors

Pleasantville, NY, United States of America

Jeffrey Alan Kash