Microchip Technology Inc.

Jeffrey A Shields

Kent D Hewitt

Donald S Gerber

Bomy A Chen

Sonu Daryanani

Mel Hymas

Jack Wong

Daniel Alvarez

David M Davies

An electrically erasable programmable read only memory (EEPROM) cell may include a substrate including at least one active region, a floating gate adjacent the substrate, a write/erase gate defining a write/erase path for performing high voltage write and erase operations, and a read gate defining a read path for performing low voltage read operations, wherein the read path is distinct from the write/erase path. This allows for a smaller read gate oxide, thus allowing the cell size to be reduced. Further, the EEPROM cell may include two independently controllable read gates, thereby defining two independent transistors which allows better programming voltage isolation. This allows the memory array to be drawn using a common source instead of each column of EEPROM cells needing its own source line. This makes the array more scalable because the cell x-dimension would otherwise be limited by each column needing two metal 1 pitches.

EEPROM memory cell with low voltage read path and high voltage erase/write path

A method for programming and erasing an array of NMOS electrically erasable programmable read only memory (EEPROM) cells that minimizes bit disturbances and high voltage requirements for the memory array cells and supporting circuits. In addition, the array of N-channel memory cells may be separated into independently programmable memory segments by creating multiple, electrically isolated P-wells upon which the memory segments are fabricated. The multiple, electrically isolated P-wells may be created, for example, by p-n junction isolation or dielectric isolation.

Method of programming an array of NMOS EEPROM cells that minimizes bit disturbances and voltage withstand requirements for the memory array and supporting circuits

Method for programming and erasing an array of NMOS EEPROM cells that minimizes bit disturbances and voltage withstand requirements for the memory array and supporting circuits

A method of writing and selectively erasing bits in a selected group of memory cells that significantly reduces the likelihood of disturbing data stored in other, non-selected groups of memory cells is disclosed. The method varies the bias voltages applied to bit lines in unselected cells depending upon the selected or non-selected state of the cells. This reduces the voltage differential applied to the unselected cells, reducing the possibility of inadvertently causing unwanted changes in the amount of charge stored on the respective floating gates of the unselected cells. The method of the present invention improves electrical isolation between columns of cells without increasing the distance between the cells.

Programming method for a memory cell

A method of applying voltages to a memory cell, such as a P-channel EEPROM cell, and in particular to applying voltages to the cell during an erase operation of the cell is described. The method recognizes that during an erase, memory cells sharing deselected word lines are susceptible to a type of program disturb which is subtle and gradually causes corruption and loss of data over many programming cycles. The method of the present invention applies a voltage to deselected word lines, which is lower in magnitude than a programming voltage. This reduces the rate at which program disturb occurs, markedly increasing the number of programming cycles to which the deselected cells may be subjected before becoming susceptible to loss of data. The endurance of the memory array is thus significantly extended.

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Chandler, AZ, United States of America

Jeffrey A Shields