Applied Materials, Inc.

Jeffrey A Kho

John M White

Shinichi Kurita

Jianhua Zhou

Robin L Tiner

Suhail Anwar

Chien-Teh Kao

Soo Young Choi

Xiangxin Rui

Carl A Sorensen

Makoto Inagawa

Gaku Furuta

Shouqian Shao

Guangwei Sun

The present disclosure relates to methods and apparatus for an atomic layer deposition (ALD) chamber. In one embodiment, a lid assembly is provided that includes a multi-channel showerhead having a plurality of first gas channels and a plurality of second gas channels that are fluidly isolated from each of the first gas channels, and a flow guide coupled to opposing sides of the multi-channel showerhead, each of the flow guides being fluidly coupled to the plurality of second gas channels.

Methods and apparatus for ALD processes

Embodiments described herein provide a chamber having a gas flow inlet guide to uniformly deliver process gas and a gas flow outlet guide to effectively purge process gasses and reduce purge time. The chamber includes a chamber body having a process gas inlet and a process gas outlet, a lid assembly, a process gas inlet and a process gas outlet configured to be in fluid communication with a processing region in the chamber, a gas flow inlet guide disposed in the process gas inlet, and a gas flow outlet guide disposed in the process gas outlet. The gas flow inlet guide includes a flow modulator and at least two first inlet guide channels having first inlet guide channel areas that are different. The gas flow outlet guide includes at least two first outlet guide channels having first outlet guide channel areas that are different.

Gas flow guide design for uniform flow distribution and efficient purge

Embodiments disclosed herein generally relate to apparatus and methods for sealing a vacuum chamber with a slit valve assembly that in one embodiment includes a housing having side walls and at least one substrate transfer port formed therein, the housing having an interior volume defined by the side walls, a slit valve door disposed within the housing and positionable between an open position clear of the substrate transfer port and a closed position sealing the substrate transfer port, and a bumper assembly disposed on an edge of at least one face of the slit valve door, the bumper assembly comprising a first bumper member made of a first material and a second bumper made of a second material that is different than the first material.

Methods and apparatus to reduce shock in a slit valve door

A method and apparatus for providing an electrically symmetrical ground or return path for electrical current between two electrodes is described. The apparatus includes at least on radio frequency (RF) device coupled to one of the electrodes and between a sidewall and/or a bottom of a processing chamber. The method includes moving one electrode relative to another and realizing a ground return path based on the position of the displaced electrode using one or both of a RF device coupled to a sidewall and the electrode, a RF device coupled to a bottom of the chamber and the electrode, or a combination thereof.

Ground return for plasma processes

Shadow frame support

Growing community of inventors

Union City, CA, United States of America

Jeffrey A Kho