Psemi Corporation

Peregrine Semiconductor Corporation

Motorola Corporation

Murata Manufacturing Co., Ltd.

Freescale Semiconductor,inc.

Jeffrey A Dykstra

Chris Olson

Dan William Nobbe

James S Cable

David Kovac

Tero Tapio Ranta

Simon Edward Willard

Sinan Goktepeli

Eric S Shapiro

Michael P Gaynor

David Halchin

Kelly Michael Mekechuk

Gary Frederick Kaatz

Jaroslaw E Adamski

Edward Nicholas Comfoltey

Christopher C Murphy

Bruce C Eastmond

Poojan Wagh

Joseph P Golat

Melvy Freeland Miller, Iii

S David Silk

Nebil Tanzi

Jean-Luc Erb

Douglas Lacy

Dan Willaim Nobbe

Jaroslaw Adamski

Smita Kanikaraj

Rodd E Novak

Kouassi Sebastien Kouassi

Kazuhiko Shibata

Shishir Ray

Circuits and methods that enable stacking of phase change material (PCM) switches and that accommodate variations in the resistance of the resistive heater(s) of such switches. Stacking is enabled by providing isolation switches for the resistive heater(s) in a PCM switch to reduce parasitic capacitance caused by the proximity of the resistive heater(s) to the PCM region of a PCM switch. Variations in the resistance of the resistive heater(s) of a PCM switch are mitigated or eliminated by sensing the actual resistance of the resistive heater(s) and then determining a suitable adjusted electrical pulse profile for the resistive heater(s) that generates a precise thermal pulse to the PCM region, thereby reliably achieving a desired switch state while extending the life of the resistive heater(s) and the phase-change material.

Phase-change material switches

Methods and devices for reading and programming a state of a switch device are presented. The programming of the state of the switch device is performed by providing driving pulses to the switch device. The amplitude and the width of the driving pulses are a function of one or more of a) temperature of the switch device, b) desired state of the switch device, and c) operational time of the switch device. The described devices include a device to store the data demonstrating the functional relation between the amplitude and the width of the driving pulses and the temperature of the switch device. Such device can be a lookup table or an arithmetic logic unit (ALU). The disclosed switch devices can be PCM switches.

Temperature-controlled driver with built-in self testing of switch status

Methods and devices to control PCM switches are disclosed. The described devices include PCM switch drivers and logic and control circuits, all integrated with the PCM and the associated heater on the same chip. Various architectures for the driver are also presented, including architectures implement feedback mechanism to mitigate variations from process, temperature, and supply voltage.

Integrated PCM driver

Methods and devices for reading and programming a state of a switch device are presented. Reading of the state is provided by measuring a resistance of the switch via injection of a current. If a measured resistance does not correspond to a resistance of an expected state, then the switch is reprogrammed, and the state reread. The switch device may form part of a complex switch circuit that includes a combination of shunt and through switch devices. Currents injected into external loads coupled to the switch circuit increase accuracy in reading of the state. Further accuracy in reading of the state of a through switch device is provided by provision of a bypass path to a shunt switch device. The complex switch circuit may be implemented as a SPDT switch including two branches, each branch including a shunt and a through switch device. Several types of switch devices, such as phase-change material (PCM) devices may be implemented.

Driver with built-in self testing of switch status

Various methods and circuital arrangements for biasing one or more gates of stacked transistors of an amplifier are presented, where the amplifier can have a varying supply voltage. According to one aspect, the gate of the input transistor of the amplifier is biased with a fixed voltage whereas the gates of the other transistors of the amplifier are biased with variable voltages that are linear functions of the varying supply voltage. According to another aspect, the linear functions are such that the variable voltages coincide with the fixed voltage at a value of the varying supply voltage for which the input transistor is at the edge of triode. According to another aspect, biasing of the stacked transistors is such that, while the supply voltage varies, the drain-to-source voltage of the input transistor is maintained to a fixed value whereas the drain-to-source voltages of all other transistors are equal to one another.

Constant VDS1 bias control for stacked transistor configuration

A scalable periphery tunable matching power amplifier is presented. Varying power levels can be accommodated by selectively activating or deactivating unit cells of which the scalable periphery tunable matching power amplifier is comprised. Tunable matching allows individual unit cells to see a constant output impedance, reducing need for transforming a low impedance up to a system impedance and attendant power loss. The scalable periphery tunable matching power amplifier can also be tuned for different operating conditions such as different frequencies of operation or different modes.

Scalable periphery tunable matching power amplifier

Constant Vds1 bias control for stacked transistor configuration

Various methods and circuital arrangements for biasing one or more gates of stacked transistors of an amplifier are presented, where the amplifier can have a varying supply voltage that varies according to a control voltage. The control voltage can be related to a desired output power of the amplifier and/or to an envelope signal of an input signal to the amplifier. Particular biasing for selectively controlling the stacked transistors to operate in either a saturation region or a triode region is also presented. Benefits of such controlling, including increased linear response of an output power of the amplifier, are also discussed.

Bias control for stacked transistor configuration

Various envelope tracking amplifiers are presented that can be switched between an ET (envelope tracking) mode and a non-ET mode. Switches and/or tunable components are utilized in constructing the envelope tracking amplifiers that can be switched between the ET mode and the non-ET mode.

Amplifiers operating in envelope tracking mode or non-envelope tracking mode

An envelope tracking amplifier having stacked transistors is presented. The envelope tracking amplifier uses dynamic bias voltages at one or more gates of the stacked transistors in addition to a dynamic bias voltage at a drain of a transistor.

Amplifier dynamic bias adjustment for envelope tracking

Control systems and methods for power amplifiers operating in envelope tracking mode are presented. A set of corresponding functions and modules are described and various possible system configurations using such functions and modules are presented.

Control systems and methods for power amplifiers operating in envelope tracking mode

Growing community of inventors

Woodstock, IL, United States of America

Jeffrey A Dykstra