Dell Products Inc.

Jeffery T Sayles

Anthony P Middleton

Tyler B Duncan

Ty R Schmitt

Mark Mcgrath Bailey

James Don Curlee

Tony P Middleton

Luis Alejandro Ruiz Holguin

Mario E Salazar Granados

A modular information technology component includes: an information handling system; a floor, in which the floor includes a floor track apparatus and the information handling system is located on the floor; and a rack mounting component, in which the rack mounting component affixes the information handling system to the floor track apparatus.

Floor track and mounting apparatus for modular data centers

A modular data center includes: a modular information technology component (MITC), in which the MITC includes a plurality of information handling systems (IHSs), a utility control component (UCC), and a first connection interface, in which the first connection interface includes a first set of mechanical and electrical connection components (MECCOMs); and a modular environmental control component (MECC), in which the MECC includes a plurality of environmental control components (ECCs) and a second connection interface, in which the second connection interface includes a second set of MECCOMs to be paired with the first set of MECCOMs to generate at least a portion of the modular data center, and in which the first connection interface is connected to the second connection interface, in which an area enclosed by the first connection interface is equal to an area enclosed by the second connection interface.

Module-to-module mechanical, electrical, and airflow connections in modular data centers

A transport support structure comprises a platform, a first frame side on the platform, a second frame side on the platform and a third frame side on the platform. The second frame side is disposed opposite and spaced apart from the first frame side, and the third frame side extends between the first and second frame sides. The transport support structure further comprises first and second support receiving members disposed under the platform. The first support receiving member includes a first opening configured to receive a first lifting device support element, and the second support receiving member includes a second opening configured to receive a second lifting device support element.

Transport system for electronic equipment racks

A modular data center includes: a modular information technology component (MITC), in which the MITC includes a first scaffold; and a modular environmental control component (MECC), in which the MECC includes a second scaffold, in which the first scaffold is connected to the second scaffold to form a scaffold interface, in which an enclosure component is affixed to an outside surface of the first scaffold and to an outside surface of the second scaffold, and in which, once affixed to the first scaffold and to the second scaffold, the enclosure component overlaps at least a portion of the scaffold interface.

Tempest seal for modular data centers

A data center, a rack information handling system (RIHS) delivery kit, and a method provide for removing an RIHS from and delivering an RIHS to a data center. The data center includes an enclosure having a raised floor and a lateral opening. The lateral opening has a bottom edge that is aligned with the raised floor in order to transfer a rack information handling system (RIHS) through the lateral opening for a selected one of: (i) removing the RIHSs from the raised floor; and (ii) delivering the RIHS to the raised floor. The data center includes a pallet interface coupled to or integrated into an exterior edge of the raised floor and vertically presented to abut and engage a lateral edge of a roll-off rack shock pallet that supports the RIHS during transport.

Pallet interface for data center and rack information handling systems

A test controller functionally tests components of a modular data center (MDC) that is being manufactured. Functional test(s) for quality assurance of an environmental control system (ECS) are determined for an information technology pre-assembled component (ITPAC) module and an environmental system (ES) module that are configured for being coupled together for cooling of heat-generating equipment of the ITPAC module at a deployed location. For each functional test(s), the test controller identifies input signal value(s) associated with one of the modules. The test controller emulates, via a communication test cable connected between the one module and the test controller, the identified input signal value(s). The test controller determines, via the communication test cable, any response by the one module to the input signal value(s). The test controller compares the determined response to an expected response and generates and outputs test data based on the comparison.

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San Marcos, CA, United States of America

Jeffery T Sayles