Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Jeffery S Hess

Naoto A Kawamura

Qin Liu

Richard W Seaver

Colin C Davis

Donald E Wenzel

Colby Van Vooren

Carl Lan Wu

Matthew David Giere

Chien-Hau Chen

Manish Giri

Ulrich E Hess

Philip H Harding

Steven David Leith

Gilbert G Smith

Chien-Hua Chen

Donald W Schulte

Martha A Truninger

Antonio Cruz-Uribe

Timothy R Emery

Jeffrey Scott Obert

Wiatt E Kettle

Mark Sanders Taylor

William J Edwards

Jeffrey M Valley

Rob Patrick Chohan

One exemplary fluid ejection device includes a substrate having one or more layers positioned thereon. The fluid ejection device also includes a fluid-feed path extending through a space which is defined, at least in part, by the one or more layers. The fluid ejection device including methods and structures for managing air and amongst other things gas bubble formation.

Air management in a fluid ejection device

A substrate for a fluid ejection device includes a first side, a second side opposite the first side, and a fluidic channel communicating with the first side and the second side. A first portion of the fluidic channel extends from the first side toward the second side, a second portion of the fluidic channel extends from the second side toward the first side, and a third portion of the fluidic channel extends from an interface between the first portion and the second portion of the fluidic channel toward the second side.

Substrate and method of forming substrate for fluid ejection device

A method of forming an opening through a substrate includes etching into the substrate from a first side so as to form a first portion of the opening, etching into the substrate from a second side opposite the first side so as to form a second portion of the opening, continuing etching into the substrate from at least one of the first side and the second side toward the other of the first side and the second side so as to communicate the first portion and the second portion of the opening, and etching into the substrate from an interface between the first portion and the second portion of the opening, including etching toward the second side of the substrate and forming a third portion of the opening.

In one embodiment, a fluid ejection device comprises a substrate having a first surface, and a fluid slot in the first surface. The device further comprises a fluid ejector formed over the first surface of the substrate, and a chamber layer formed over the first surface of the substrate. The chamber layer defines a chamber about the fluid ejector, wherein fluid flows from the fluid slot towards the to be ejected therefrom. The chamber layer has a discontinuity, wherein the discontinuity is positioned over the fluid slot.

Fluid ejection device having a layer with a discontinuity

A printhead including a printhead substrate having at least one opening formed in a first surface to provide a fluid path through the substrate. The printhead further includes a thin film membrane formed on a second surface of the substrate. The thin film membrane includes a plurality of fluid ejection elements and has a floating section and a cantilevered section, which are detached and separated from one another by a gap.

Printhead having a thin film membrane with a floating section

A fluid ejection device is described. One exemplary embodiment includes a substrate having a first surface and a second surface, the substrate defines a fluid supply conduit between the first surface and the second surface. This particular fluid ejecting device also includes a generally elastic filter layer formed over the first surface where the filter layer does not form sidewalls defining a fluid channel of the fluid ejection device.

Fluid ejection device having a substrate to filter fluid and method of manufacture

An integrated fluid ejection device includes a fluid ejection element; a fluid filter; and a feed trench between the filter and the fluid ejection element. The fluid ejection element, fluid filter, and feed trench are formed from a single substrate.

Integrated fluid ejection device and filter

A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced stops in the first side of the substrate, partially forming a first portion of the opening in the substrate from the second side by a first process, further forming the first portion of the opening in the substrate from the second side by a second process, including forming the first portion of the opening to the spaced stops, and forming a second portion of the opening in the substrate from the first side, including forming the second portion of the opening between the spaced stops.

A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.

Direct imaging polymer fluid jet orifice

A method of forming an opening through a substrate includes etching a first portion of the opening into the substrate from a first side, etching a plurality of second portions of the opening into the substrate from a second side opposite the first side, continued etching of at least one of the first portion and the plurality of second portions of the opening to the other of the first portion and the plurality of second portions of the opening, and overetching each of the second portions of the opening at an interface between the first portion and each of the second portions of the opening, including communicating each of the second portions with an adjacent one of the second portions.

A floor printer has a printing device and a fiducial nozzle along a bottom of a housing. The fiducial nozzle deposits a marks on a medium. The printing device forms an image on the medium.

Floor printer

Embodiments of the present invention comprise capillary fluid transport and containment structures in which a capillarity gradient is provided in a direction other than the primary direction of fluid transport to selectively capture and transport gas bubbles. The structures may be formed with single capillary members or may include a plurality of capillaries, such as sheet capillaries joined by appropriately sized through-holes.

Graded capillarity structures for passive gas management, and methods

A through-substrate etching process is monitored by providing a sacrificial electrode in proximity to a desired etch window on the substrate. An etch process is performed on the substrate. The etch process is monitored by measuring an electrical property of either the substrate or the sacrificial electrode or both.

Growing community of inventors

Corvallis, OR, United States of America

Jeffery S Hess