Juniper Networks, Inc.

Jeffery J Maki

Yang Yue

Domenico Di Mola

Zhen Qu

Steven B Alleston

Ryan Holmes

Jon J Anderson

Chul Soo Park

Christopher Otte

Attila I Aranyosi

A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

External laser enabled co-packaged optics architectures

The disclosed apparatus may include (1) a plenum that (A) interfaces with a panel of a telecommunications system that facilitates traffic within a network and (B) reduces a gap between the panel of the telecommunications system and a removable telecommunications module that is installed into the telecommunications system and (2) an air channel that is incorporated in the plenum, wherein the air channel directs airflow into a vent hole of the panel of the telecommunications system. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for directing airflow across heatsinks external to telecommunications devices

Growing community of inventors

Dublin, CA, United States of America

Jeffery J Maki