Raytheon Company

Jeffery H Burkhart

Sean P Kilcoyne

Eric R Miller

Eric Miller

An integrated circuit assembly including a first wafer bonded to a second wafer with an oxide layer, wherein a first surface of the first wafer is bonded to a first surface of the second wafer. The assembly can include a bonding oxide on a second surface of the second wafer, wherein a surface of the bonding oxide is polished. The assembly can further include a shim secured to the bonding oxide on the second surface of the second wafer to reduce bow of the circuit assembly.

Wafer level shim processing

Methods and apparatus for proving a sensor assembly. Embodiments can include employing a circuit assembly having a first layer bonded to a second layer with an oxide layer, depositing bonding oxide on the second layer of the circuit assembly, and thinning the first layer of the circuit assembly after depositing the bonding oxide. A coating can be applied over at least a portion of the first layer of the circuit assembly after annealing the circuit assembly. After polishing the bonding oxide on the second surface of the second layer of the circuit assembly, a shim can be secured to the bonding oxide on the second surface of the second layer of the circuit assembly to reduce bow of the assembly. Embodiments can provide a sensor useful in focal plane arrays.

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Orcutt, CA, United States of America

Jeffery H Burkhart