Hutchinson Technology Corporation

Jeffery G Ribar

Clark T Olsen

Michael Wayne Davis

Zachary A Pokornowski

John A Theget

Joel B Michaletz

Terry W Zeller

Ronald A Greeley

A method for producing a component without tabs during etching. The method includes: applying a wafer tape to the plated side of the substrate; depositing a resist layer on a metal layer on a metal side of the substrate that is opposite of the plated side; exposing the resist layer to UV light; developing the resist layer; and etching the metal layer.

Method for forming components without adding tabs during etching

An apparatus is described. The apparatus includes a substrate and one or more sensor components formed on the substrate. And, the apparatus includes one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.

Apparatus and method for forming sensors with integrated electrical circuits on a substrate

A backside connection access structure and method for manufacturing are described. The method including forming a gold layer over at least a portion of a substrate. The method also including forming a metal layer over the gold layer. And, the method includes forming an opening in the substrate to expose at least a portion of the gold layer.

Gold plating on metal layer for backside connection access

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Brownton, MN, United States of America

Jeffery G Ribar