Amkor Technology, Inc.

Petsmart Home Office, Inc.

Jeff Watson

Lisa Mae Beilke

Steve Chattin

Miguel Angel Jimarez

Bora Baloglu

Ahmer Raza Syed

Floating decoration for aquarium

A warpage control stiffener ring package includes a substrate having an upper surface and corners. A segmented stiffener ring is formed of 'L' shaped segments, each segment being mounted to the upper surface at a corner of the substrate, wherein a gap exists between each of the segments. By forming the segmented stiffener ring of segments having gaps therebetween, warpage of the segmented stiffener ring itself, and thus the thermal stress applied by the segmented stiffener ring on to the substrate, is reduced as compared to a continuous stiffener ring. This allows the segmented stiffener ring to be designed to minimize warpage of the warpage control stiffener ring package.

Warpage control stiffener ring package and fabrication method

A novel die seal design, and method for utilization thereof, controls contact of a mold material with the surfaces of a semiconductor die during application, reducing stresses due to a mismatch of the coefficient of thermal expansion of the mold material and the semiconductor die, thereby reducing cracking of the semiconductor die, resulting in increased yields and lower costs, and permits reuse of elements of a mold tool over a range of die sizes.

Method for controlling molding compound geometry around a semiconductor die

Growing community of inventors

Phoenix, AZ, United States of America

Jeff Watson