Tosoh Smd, Inc.

Jeff Hart

Ann Bolcavage

David B Smathers

Eugene Y Ivanov

Hao Zhang

Weifang Miao

Erich Theado

Robert S Bailey

A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface. A second metal or alloy is placed around the target blank. A backing plate is provided adjacent the second metal or alloy that is positioned alongside of the second target surface. This assembly is then diffusion bonded, and a portion of the second metal overlying the sputtering surface of the target is removed to expose the target sputtering surface. W target or W alloy target/Ti or Ti alloy backing plate assemblies are provided with an Al interlayer positioned intermediate the W or W alloy target and backing plate. The assembly has a bond strength exceeding 50 MPa.

Diffusion-bonded sputter target assembly and method of manufacturing

A sputter target assembly including a high purity copper sputter target diffusion bonded to a backing plate, preferably composed of either aluminum, aluminum alloy, aluminum matrix composite materials, copper, or copper alloy, and a Ni-alloy interlayer, preferably composed of Ni&mdash;V, Ni&mdash;Ti, Ni&mdash;Cr, or Ni&mdash;Si, located between and joining the target and backing plate, and a method for making the assembly. The method of making involves depositing (e.g., electroplating, sputtering, plasma spraying) the interlayer on a mating surface of either the sputter target or backing plate and pressing, such as hot isostatically pressing, the sputter target and backing plate together along mating surfaces so as to form a diffusion bonded sputter target assembly.

Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers

An improved method for joining mating surfaces of a metallic sputter target and a backing plate of aluminum, aluminum alloy or aluminum matrix composite material to form a sputter target/backing plate assembly comprises the steps of roughening the mating surface of either the sputter target or the backing plate to form a plurality of salient portions; depositing an intermediate layer comprising nickel on that mating surface; pressing the sputter target and the backing plate together along the mating surfaces so as to disrupt the mating surfaces; and holding the sputter target and the backing plate in contact at a temperature just below the melting points of the sputter target and backing plate materials to promote diffusion bonding. In an especially preferred form of the invention, the mating surface on the harder of the sputter target or the backing plate is roughened by machining a series of concentric grooves. The grooved mating surface is covered by a layer of nickel having a consistent thickness, preferably by means of electroplating, sputtering, electroless plating, or as a foil. The sputter target and the backing plate are then joined along the mating surfaces using hot isostatic pressing or vacuum hot pressing.

Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers

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Columbus, OH, United States of America

Jeff Hart