Cypress Semiconductor Corporation

Jeff Hall

Brenor L Brophy

Marc D Hartranft

Syed Tariq Shafaat

The quality and reliability of electro-optical modules can be improved, for instance, through improved testing and burn-in of an electro-optical sub-assembly. Reliability can also be enhanced through better methods of constructing an electro-optical module. By arranging both an electrical interface and an optical interface on a sub-assembly, for instance, testing can be performed on both interfaces in a single testing process. Burning-in an electro-optical sub-assembly can also improve the reliability of the module by identifying defects. A method of forming an electro-optical module can provide improved reliability by testing and/or burning-in an electro-optical sub-assembly before assembling the module.

Methods of improving reliability of an electro-optical module

A method of manufacturing a plurality of electro-optical sub-assemblies in parallel is provided. A plurality of printed circuit boards (PCBs) are preferably formed in a panel of flex material. Rigid substrates can be arranged along regions of the PCBs. A plurality of electrical components, including electro-optical semiconductor devices, are preferably located on the rigid substrates. Lens arrays are preferably aligned over the electro-optical semiconductor devices, such as through an alignment mechanism. The PCBs can then be singulated into individual electro-optical sub-assemblies. The rigid substrates can be a plurality of leadframes formed on a matrix leadframe. The matrix leadframe is preferably attached to the panel of flex material such that the leadframes are arranged in proximity to leadframe cutout regions of the PCBs. Electrical interconnections are then preferably formed between the electrical components on the leadframe and the PCBs.

Method of manufacturing electro-optical devices

An electro-optical apparatus constructed according to various inventive principles disclosed herein provides flexibility in the type and arrangement of components. The electro-optical apparatus preferably includes a Printed Circuit Board (PCB). An interface device can be electrically connected to the PCB, and an electro-optical device can be electrically connected to the interface device. A lens is preferably arranged in optical communication with the electro-optical device. Numerous variations in component selection and arrangement are contemplated within the scope of these inventive principles. Various methods for configuring an electro-optical apparatus are also provided.

Electro-optical apparatus

An electro-optical device preferably includes a printed circuit board (PCB) having a cutout region or a rigid region. A leadframe having an electro-optical semiconductor device arranged thereon can be arranged in proximity to the cutout region of the PCB. Alternatively, the electro-optical device can be arranged on the rigid region of the PCB. A lens is preferably arranged over the electro-optical semiconductor device. A connector array can also be arranged on the PCB to communicate electrical signals with an external device. An interface circuit, such as a driver circuit or an amplifier circuit, can also be arranged in close proximity to the electro-optical semiconductor devices on the leadframe or the PCB.

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Atlanta, GA, United States of America

Jeff Hall