Sharp Microelectronics Technology, Inc.

Sharp Kabushiki

Jeff E Conder

Meral Bradley Woodberry

A modified lead frame is provided for use with electrical component test handlers. A conventional multiple-parallel-conductor lead frame is modified to include two broad, electrically conductive shields positioned on opposite sides of the lead frame. Each shield covers a major portion of one side of the lead frame. Such lead frames are designed for mounting in a predetermined orientation on a lead frame holder, with one side facing toward, and the other side facing away from, the major mass of the holder. The conductive shield positioned on the side facing away from the holder on the modified lead frame of the present invention is electrically coupled to one or more selected conductors on the lead frame. The one or more selected conductors include the power or ground conductor which supplies power to a test component during tests. The shield which faces toward the holder is electrically isolated from all the conductors on the lead frame by an intermediate insulating layer. The shields are affixed to the lead frame in a manner that does not interfere with the flexibility of the lead frame. Consequently, the lead frame can be mounted on a holder and used in the normal manner during component testing. The modifications to the lead frame substantially reduce the inductance of the conductor carrying the power/ground signal during high frequency testing, thereby reducing noise and improving test results. The modified lead frame is fully compatible with conventional lead frame holders used in the present generation of electronic component test handlers. A method for modifying a conventional lead frame is also disclosed.

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Vancouver, WA, United States of America

Jeff E Conder