Cornell Research Foundation Inc.

Cornell University

USA As Represented by Secretary of the Navy

Naval Research Laboratory

Navel Research Laboratory

Jeevak M Parpia

Harold G Craighead

Maxim K Zalalutdinov

Robert B Reichenbach

Brian H Houston

Keith Aubin

Bojan Robert Ilic

Jeffrey W Baldwin

Joshua D Cross

Anatoli Olkhovets

Leon M Bellan

Bojan (Rob) Ilic

David Alan Czaplewski

Darren Robert Southworth

Alan T Zehnder

Lidija Sekaric

Keith L Aubin

Maxim Zalalutidinov

A composite, analyte sensor includes a substrate; a micro- or nano-electro-mechanical (MEMS; NEMS) resonator that is coupled to the substrate at least two edge locations (i.e., it is at least doubly-clamped) of the resonator, wherein the resonator is in a statically-buckled state near a buckling transition point of the resonator; and a chemically-responsive substance covering at least a portion of the surface of the resonator that will undergo a conformational change upon exposure to a given analyte. The resonator may be a double-clamped, statically-buckled beam (or bridge), a multiply-clamped, statically-buckled dome (or crater), or other resonator geometry. The sensor may include two or more at least double-clamped, statically-buckled, composite MEMS or NEMS resonators each operating near a buckling transition point of the respective resonator, and each characterized by a different resonant frequency. A method for sensing an analyte in ambient air.

Stress-based sensor, method, and applications

Methods and systems for object identification and/or authentication.

Methods and systems for object identification and for authentication

The present invention is directed to a CMOS integrated micromechanical device fabricated in accordance with a standard CMOS foundry fabrication process. The standard CMOS foundry fabrication process is characterized by a predetermined layer map and a predetermined set of fabrication rules. The device includes a semiconductor substrate formed or provided in accordance with the predetermined layer map and the predetermined set of fabrication rules. A MEMS resonator device is fabricated in accordance with the predetermined layer map and the predetermined set of fabrication rules. The MEMS resonator device includes a micromechanical resonator structure having a surface area greater than or equal to approximately 20 square microns. At least one CMOS circuit is coupled to the MEMS resonator member. The at least one CMOS circuit is also fabricated in accordance with the predetermined layer map and the predetermined set of fabrication rules.

CMOS integrated micromechanical resonators and methods for fabricating the same

A source signal is converted into a time-variant temperature field with transduction into mechanical motion. In one embodiment, the conversion of a source signal into the time-variant temperature field is provided by utilizing a micro-fabricated fast response, bolometer-type radio frequency power meter. A resonant-type micromechanical thermal actuator may be utilized for temperature read-out and demodulation.

Thermal-mechanical signal processing

A method for manufacturing or preparing thin-film stacks that exhibit moderate, finite, stress-dependent resistance and which can be incorporated into a transduction mechanism that enables simple, effective signal to be read out from a micro- or nano-mechanical structure. As the structure is driven, the resistance of the intermediate layers is modulated in tandem with the motion, and with suitable dc-bias, the motion is directly converted into detectable voltage. In general, detecting signal from MEMS or NEMS devices is difficult, especially using a method that is able to be integrated with standard electronics. The thin-film manufacturing or preparation technique described herein is therefore a technical advance in the field of MEMS/NEMS that could enable new applications as well as the ability to easily develop CMOS-MEMS integrated fabrication techniques. Also disclosed are: (i) transducers where current flows across a piezo layer from one major surface to the opposite major surface; and (ii) methods of making a transducer the resistivity of a piezoresistive layer is decreased and/or the gauge factor of a piezoresistive layer is increased.

Method for making a transducer, transducer made therefrom, and applications thereof

An array of micromechanical oscillators have different resonant frequencies based on their geometries. In one embodiment, a micromechanical oscillator has a resonant frequency defined by an effective spring constant that is modified by application of heat. In one embodiment, the oscillator is disc of material supported by a pillar of much smaller diameter than the disc. The periphery of the disc is heated to modify the resonant frequency (or equivalently the spring constant or stiffness) of the disc. Continuous control of the output phase and frequency may be achieved when the oscillator becomes synchronized with an imposed sinusoidal force of close frequency. The oscillator frequency can be detuned to produce an easily controlled phase differential between the injected signal and the oscillator feedback. A phased array radar may be produced using independent phase controllable oscillators.

MEMS controlled oscillator

A micromechanical resonator is formed on a substrate. The resonator has a partial spherical shell clamped on an outside portion of the shell to the substrate. In other embodiments, a flat disc or other shape may be used. Movement is induced in a selected portion of the disc, inducing easily detectible out-of-plane motion. A laser is used in one embodiment to heat the selected portion of the disc and induce the motion. The motion may be detected by capacitive or interferometric techniques.

Shell type actuator

A micro-electrical mechanical oscillator has a resonant frequency of oscillation that is varied by application of heat. The resonant frequency is varied at a frequency different from the resonant frequency of the oscillator to amplify oscillations. In one embodiment, the oscillator is disc of material supported by a pillar of much smaller diameter than the disc. The periphery of the disc is heated by a laser to provide a time varying shift of the resonant frequency (or equivalently the stiffness) of the disc. Feedback from movement of the disc is used to modulate the intensity of the laser, and thus the stiffness of the disc to provide parametric amplification of sensed vibrations, using heating as a pump. Various other shapes of micro-electrical mechanical oscillators are used in other embodiment, including an array of such oscillators on a substrate, each having different resonant frequencies.

Heat pumped parametric MEMS device

The temperature of a remote portion of device having a microelectromechanical oscillator is modulated to create oscillation of the oscillators. In one embodiment, a localized heat source is placed on a device layer of a multilayered stack, consisting of device, sacrificial and substrate layers. The localized heat source may be a laser beam in one embodiment. The oscillator is supported by the device layer and may be formed in the device layer in various embodiments. The oscillator may be spaced apart from the localized heat source.

Growing community of inventors

Ithaca, NY, United States of America

Jeevak M Parpia