At&s (chongqing) Company Limited

At&s Austria Technologie & Systemtechnik Aktiengesellschaft

At&s (china) Co. Ltd.

Jeesoo Mok

Mikael Tuominen

Seok Kim Tay

Artan Baftiri

Yu-Hui Wu

A component carrier has a stack including a plurality of electrically insulating layer structures and at least one electrically conductive layer structure, wherein two of the at least two electrically insulating layer structures form a dielectric double layer made of two different materials; a through-hole extending through the double dielectric layer; and an electrically conductive material filling at least a part of the through-hole. A method of manufacturing a component carrier is also disclosed.

Component carrier having a double dielectric layer and method of manufacturing the same

A method of manufacturing a component carrier includes forming a stack having electrically conductive layer structures and electrically insulating layer structures; configuring the stack as a redistribution structure for transferring between a smaller pitch on one side of the stack towards a larger pitch on an opposing side of the stack; and arranging a first layer structure and a second layer structure in opposing surface regions of the stack. The first layer structure includes a group of first electrically conductive elements arranged in a first density and the second layer structure includes a group of second electrically conductive elements arranged in a second density. At least one of the electrically conductive layer structures of the stack, which forms the redistribution structure, includes a group of vertically and/or horizontally arranged connections arranged in a third density. The third density is higher than the first density and higher than the second density.

Ultra-thin component carrier having high stiffness and method of manufacturing the same

A method of manufacturing a component carrier includes: (i) embedding a poorly adhesive structure in a stack, wherein the stack comprises at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) forming a cavity in the stack by removing a stack piece, wherein the stack piece is in part delimited by the poorly adhesive structure; and (iii) selectively exposing a bottom of the cavity by partially removing the poorly adhesive structure. A corresponding component carrier includes analogous features.

Embedding methods for fine-pitch components and corresponding component carriers

A component carrier includes a glass core having a first main surface and a second main surface; a first electrically insulating layer structure applied on the first main surface of the glass core; a first electrically conductive layer structure applied on the first electrically insulating layer structure; and at least one inner hole extending through the glass core and the first electrically insulating layer structure.

Component carrier and method of manufacturing the same

A method of manufacturing a component carrier includes forming a stack with electrically conductive layer structures and at least one electrically insulating layer structure; configuring the stack as a redistribution structure for transferring between a smaller pitch on one side of the stack towards a larger pitch on an opposing other side of the stack; arranging a first stiffening structure and a second stiffening structure in opposing surface regions of the stack. A component carrier and an electric device manufactured with the method exhibit improved stiffness and signal integrity.

A method of manufacturing a component carrier includes a step of stacking and connecting a first component and a second component to one another to form a cluster and thereafter, a step of inserting the cluster into a cavity of a base structure. A component carrier has a base structure with a cavity; a cluster having a first component stacked and connected with a second component, wherein the cluster is arranged in the cavity. A height difference between opposing lateral sidewalls of the cluster is less than 15 &#x3bc;m.

A method of manufacturing a component carrier is disclosed. The method includes forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; patterning a front side of the stack using a first photo-imageable dielectric; and patterning a back side of the stack. A component carrier is also disclosed.

Growing community of inventors

Chongqing, China

Jeesoo Mok