Samsung Electro-mechanics Co., Ltd.

Jee Soo Mok

Chang Sup Ryu

Je Gwang Yoo

Eung Suek Lee

Jun Heyoung Park

Jun Oh Hwang

Tae Hoon Kim

Sang Hyun Park

Yoong Oh

Suk-Hyeon Cho

Byung Kook Sun

Duck Young Maeng

Chang-Kyu Song

Sung Yong Kim

Jong Suk Bae

Disclosed is a die mounting substrate, which includes a mounting substrate having a pad, a die having a terminal and surface-mounted on the mounting substrate, and a conductive paste bump formed on the pad or the terminal so as to connect the pad and the terminal to each other. When the die is connected and mounted on the mounting substrate using the conductive paste bump, shear stress is relieved thus preventing reliability from decreasing due to a difference in the coefficient of thermal expansion between the die and the mounting substrate, and also preventing the force of adhesion of the bump from decreasing due to the reduction in size of the pad of the mounting substrate.

Die mounting substrate and method of fabricating the same

A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

Method of manufacturing printed circuit board

A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

Method of manufacturing cooling fin and package substrate with cooling fin

A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The manufacturing process includes a step of pressing the circuit layer and the insulating material into the insulating layer to form a level surface while leaving the connection pads flush at the surface. The method makes the printed circuit board slim, and increases reliability and the degree of design freedom.

Printed circuit board and method of manufacturing the same

A method of fabricating a printed circuit, which involves forming a bump on a first metal layer; laminating an insulating layer on the bump so that the bumps passes through the insulating layer; placing a second metal layer on the insulating layer and then conducting heating and pressing, thus laminating the second metal layer on the insulating layer; etching the first metal layer and the second metal layer, thus forming circuit patterns on both surfaces of the insulating layer; and heating and pressing both surfaces of the insulating layer, thus embedding the circuit patterns in the insulating layer, such that the circuit pattern is embedded in an insulating layer to decrease the thickness of a printed circuit board, and the time and cost required for the process of fabricating a printed circuit board are decreased.

Method of fabricating a printed circuit board

A method of fabricating a paste bump for a printed circuit board, provides preparing a base plate; printing a conductive paste on the base plate and drying the conductive paste on the base plate, thus forming a first paste bump; flattening an upper surface of the first paste bump through coining; and printing a conductive paste on the first paste bump and drying the conductive paste on the first bump, thus forming a second paste bump, wherein the printing a conductive paste on the base plate and drying the conductive paste on the base plate includes placing a first mask having a hole having a first size on the base plate; applying a conductive paste on the first mask, and pressing the conductive paste using a squeegee; filling the hole having a first size in the first mask with the conductive paste, and sticking a bottom of the conductive paste to the base plate; and removing the first mask and drying the conductive paste, thus forming the first paste bump.

Method of fabricating paste bump for printed circuit board

Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.

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Gyunggi-do, South Korea

Jee Soo Mok