Samsung Electro-mechanics Co., Ltd.

Jee-Soo Mok

Dong-Jin Park

Chang-Sup Ryu

Ki-Hwan Kim

Jun-Heyoung Park

Young-Gwan Ko

Yoong Oh

Yong-Ho Baek

Kyung-Hwan Ko

Jae-Ean Lee

Byung-Bae Seo

Hee-Bum Shin

Eung-Suek Lee

Soon-Oh Jung

Sung-Yong Kim

Tae-Hoon Kim

Myung-Sam Kang

Je-Gwang Yoo

Jang-Kyu Kang

Youn-Soo Seo

Jong-Seok Bae

Byung-Kook Sun

Geum-Hee Yun

Tae-Kyoung Kim

Chang-Hyun Nam

Jun-Oh Hwang

Chang-Kyu Song

Jeong-Ho Moon

Jae-Hyun Eom

Kyung-Ah Lee

Sung-Young Kim

Jong-Suk Bae

A printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.

Printed circuit board with dam around cavity and manufacturing method thereof

A printed circuit board includes: a core board including, on a first surface thereof, an element mounting part and an element non-mounting part; an insulation layer disposed on the element non-mounting part; a copper-clad laminate plate disposed on the insulation layer; a first penetration via penetrating the insulation layer and the copper-clad laminate plate; and a second penetration via disposed in the core board and connected to the first penetration via.

Printed circuit board, package and method of manufacturing the same

A printed circuit board including an electronic component and a method of producing the same are provided. The printed circuit board includes a multilayered substrate including an insulation layer and an inner circuit layer laminated therein, a cavity disposed in the multilayered substrate, a via disposed in the insulation layer and configured to electrically connect the inner circuit layer with another inner circuit layer, a first electronic component inserted in the cavity, and a bump pad disposed on a surface of the cavity facing the first electronic component, and the bump pad is formed by having the insulation layer and the via exposed to a lateral side of the cavity.

Printed circuit board with embedded electronic component and manufacturing method thereof

A printed circuit board includes: an insulating layer including a cavity formed therein, the cavity being recessed into the insulating layer from a top surface of the insulating layer; a first circuit layer formed inside the insulating layer such that a portion of the first circuit layer is disposed within the cavity; a second circuit layer disposed above the insulating layer; a first surface-treated layer disposed above the portion of the first circuit layer disposed within the cavity; and a second surface-treated layer disposed above the second circuit layer.

Printed circuit board and method of manufacturing the same

The present invention provides a method for manufacturing a printed circuit board and a print circuit board manufactured thereby, in which through holes of a core board are filled by reverse pulse plating so that it allows to manufacture a core board having greater than 100 &#x3bc;m of a thickness which has been a processing limitation with conventional technologies and form bumps on a thick insulation layer, which has been difficult till now, and thus providing resistance against pressure of paste bumps produced during stacking due to the increased strength of a core board, convenience to join between layers, excellent heat-releasing effect, and collectively stacking of core boards, which was not possible with conventional methods.

Printed circuit board using bump and method for manufacturing thereof

A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability.

Conductive paste, printed circuit board, and manufacturing method thereof

A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include a first insulation layer, a second insulation layer stacked over the first insulation layer, a circuit pattern and a via land buried in the second insulation layer, and a via made of a conductive material penetrating the first insulation layer and integrated with the via land. The circuit pattern and via land can be buried in the insulation material, and the circuit pattern, via land, and via can be formed simultaneously as an integrated structure. Thus, the electrical reliability between the wiring pattern and the via can be increased, the heat-releasing effect of the via can be improved, and the procedure for forming the circuit patterns, via lands, and vias can be simplified, allowing greater productivity in manufacturing the substrate.

Method of manufacturing a printed circuit board

A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board, by forming at least one bump for interlayer conduction on a surface of a board and stacking an insulation layer on the surface of the board, can include the operations of forming at least one dam on the surface of the board that surrounds a region corresponding to the bump, forming the bump by printing conductive paste onto the region corresponding to the bump, and stacking the insulation layer onto the surface of the board. This method can be utilized to improve productivity and resolve the problem of spreading.

Printed circuit board and manufacturing method thereof

A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

An apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.

Apparatus for manufacturing printed circuit board

A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

Printed circuit board using paste bump and manufacturing method thereof

A manufacturing method of a package on package with a cavity. The method can include forming a first upper substrate cavity in one side of an upper substrate; mounting an upper semiconductor chip on the other side of the upper substrate; forming a lower substrate cavity in one side of a lower substrate; mounting a lower semiconductor chip in the lower substrate cavity formed in the lower substrate; and stacking the upper substrate above the lower substrate such that the first upper substrate cavity accommodates a part of the lower semiconductor chip. The package on package and a manufacturing method thereof can reduce the overall thickness of the package by forming cavities in both upper and lower substrates to accommodate a semiconductor chip mounted in the lower substrate.

Method for manufacturing package on package with cavity

A core substrate using paste bumps, the core substrate including a first paste bump board having a plurality of first paste bumps joined to a surface thereof; a second paste bump board having a plurality of second paste bumps facing the first paste bumps joined thereto; and an insulation element placed between the first paste bump board and the second paste bump board. In the core substrate, the first paste bumps and the second paste bumps are electrically interconnected.

Multilayer printed circuit board using paste bumps

A manufacturing method for a printed circuit board is disclosed. The method includes: forming a first circuit pattern on a metal layer of a conductive carrier, which has the metal layer stacked on one side, pressing the conductive carrier and a first insulation layer together with the first circuit pattern facing the first insulation layer, forming a via by selectively removing the conductive carrier, and removing the metal layer. Using this method, a high-density thin package can be manufactured with increased reliability, and the productivity of the manufacturing process can also be improved.

Growing community of inventors

Yongin-si, South Korea

Jee-Soo Mok