Other

Yield Engineering Systems, Inc.

Jed Hsu

Christopher F Lane

Dominik J Schmidt

M Ziaul Karim

Ronald R Stevens

Lei Jing

Prasanna R Chitturi

Eli Vronsky

Gabriel Ormonde

Taylor Nguyen

Dominik Schmidt

Ken Sautter

A single-layer redistribution plate functioning as a space translator between a device under testing ('DUT') and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.

Redistribution plate

A solder reflow oven includes a processing chamber that defines an enclosure. The enclosure includes a spindle configured to support a substrate and rotate the substrate about a central axis of the processing chamber. The spindle is also configured to move vertically along the central axis and position the substrate at different locations within the enclosure. The oven further includes a chemical delivery tube configured to direct a chemical vapor into the enclosure, a lamp assembly configured to heat a top surface of the substrate, and a lift assembly configured to move the spindle along the central axis.

Processing oven

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Fremont, CA, United States of America

Jed Hsu