Facebook Technologies, LLC

Meta Platforms Technologies, LLC

Microsoft Technology Licensing, LLC

Jeb Wu

Daniel Brodoceanu

Oscar Torrents Abad

Zheng Sung Chio

Ali Sengül

Tennyson Nguty

Pooya Saketi

Allan Pourchet

Yarn Chee Poon

Chao Kai Tung

Sharon Nanette Farrens

James Randolph Webster

Steven John Robbins

Richard Allen James

Robin Sharma

Karol Constantine Hatzilias

Christopher Yuan Ting Liao

Richard Andrew Wall

Steve Robbins

Tuomas Heikki Sakari Vallius

Angus Wu

Remi Alain Delille

Paul Armen Tchertchian

KengHui Lin

Tennyson Nquty

Sharon Nannette Farrens

Chienchih Hsiung

Freeway Lin

RuPing Huang

Robin Hsiung

Remi Delile

Shari Farrens

Ali Sengul

Oscar Abad Torrents

The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be &#x3bc;LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers

Curing pre-applied and plasma-etched underfill via a laser

Selectively bonding light-emitting devices via a pulsed laser

Embodiments relate to using nanoporous metal tips to establish connections between a first body and a second body. The first body is positioned relative to the second body to align contacts protruding from a first surface of the first body with electrodes protruding from a second surface of the second body. The second surface faces the first surface. The contacts, the electrodes, or both comprise nanoporous metal tips. A relative movement is made between the first body and the second body after positioning the first body to approach the first body to the second body. The contacts and the electrodes are bonded by melting and solidifying the nanoporous metal tips after approaching the first body and the second body.

Hybrid interconnect for laser bonding using nanoporous metal tips

A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.

Interconnect with nanotube fitting

Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers

The disclosed transparent circuit board may include a transparent substrate, a first conductive trace coupled to the transparent substrate, and an electrical component having a bottom surface facing the transparent substrate and a top surface facing away from the transparent substrate. The bottom surface may include a first electrical contact coupled to the first conductive trace, and the top surface may include a second electrical contact. The transparent circuit board may also include a second conductive trace electrically connected to the second electrical contact and a transparent encapsulation layer coupled to the transparent substrate and encapsulating the electrical component. Various other ophthalmic devices, systems, and methods are also disclosed.

Transparent circuit boards with multilayered traces

Embodiments relate to the design of an electronic device capable having flexible interconnects that connect together a first body and a second body of the electronic device. The flexible interconnects allow the electrical device to better withstand thermal-mechanical stress during fabrication of the electronic device and user usage of the electronic device.

Flexible interconnect using conductive adhesive

A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via magnetized interconnects. The backplane substrate may include circuits for driving the LED array, and each of the magnetized interconnects electrically connect a LED device to a corresponding circuit of the backplane substrate. The magnetized interconnects may be formed by electrically connecting first structures protruding from the backplane substrate to second structures protruding from the LED substrate. At least one of the first structure and the second structure includes ferromagnetic material configured to secure the first structure to the second structure.

Magnetic clamping interconnects

A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes one or more dummy electrodes that corresponds to one or more contacts on the substrate. The one or more dummy electrodes are exposed to a laser beam for coupling the one or more dummy electrodes to the one or more contacts. The one or more dummy electrodes may be positioned along edges of the LED chip that surround a display area of the LED chip and provide bonding strength between the LED chip and the substrate.

Bonding dummy electrodes of light emitting diode chip to substrate

A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.

Bonding corners of light emitting diode chip to substrate using laser

A light-emitting diode (LED) array is formed by bonding an LED chip or wafer to a backplane substrate via curved interconnects. The backplane substrate may include circuits for driving the LED's. One or more curved interconnects are formed on the backplane substrate. A curved interconnect may be electrically connected to a corresponding circuit of the backplane substrate, and may include at least a portion with curvature. The LED chip or wafer may include one or more LED devices. Each LED device may have one or more electrical contacts. The LED chip or wafer is positioned above the backplane substrate to spatially align electrical contacts of the LED devices with the curved interconnects on the backplane substrate. The electrical contacts are bonded to the curved interconnects to electrically connect the LED devices to corresponding circuits of the backplane substrate.

Curved pillar interconnects

Introduced here is a display device that comprises a light emitter and a diffractive optical element (DOE) that is optically coupled to receive light from the light emitter and to convey the light along an optical path. The DOE may have an input surface and an output surface parallel to the input surface, where the input surface and the output surface each have a central region and a peripheral region. The DOE further may have optical characteristics such that light exiting the DOE in the peripheral region of the output surface has greater brightness than light exiting the DOE in the central region of the output surface.

Display device with optics for brightness uniformity tuning having DOE optically coupled to receive light at central and peripheral regions

Growing community of inventors

Redmond, WA, United States of America

Jeb Wu