Bae Systems Information and Electronic Systems Integration Inc.

Jeannie Geneczko

Richard Blackwell

Daniel J O'Donnell

Richard J Blackwell, Jr

Tuyet T Bach

Margaret Kohin

A post-supported bolometer pixel and a process for manufacturing it comprising the steps of depositing a sacrificial layer over a substrate with readout integrated circuit pads that connect to the integrated circuit; forming vias through the sacrificial layer to the metal pads connecting to the readout integrated circuit; filling the vias with metal and polishing said metal to the surface of the sacrificial layer; forming microbolometer pixel layers over the filled vias and sacrificial layer; and removing the sacrificial layer to leave a post-supported pixel.

Post-supported microbolometer pixel

A microbolometer pixel and a reduced-step process for manufacturing it comprising the step of ion implantation of vanadium oxide whereby VOis converted to a low resistivity mixed phase vanadium oxide (VO/VO/VO/V) in the leg, metallized support post, and detector contact areas. Masking maintains high temperature coefficient of resistance (TCR) VOin the sensing portion of the pixel bridge region. The implanted area resistivity and TCR can be controlled by ion implantation dose and energy.

Microbolometer pixel and fabrication method utilizing ion implantation

A process and system for a medium wave infrared (MWIR) uncooled microbolometer focal plane array (FPA). One embodiment is for a single MWIR band uncooled IR detector, wherein the design and fabrication utilizes standard silicon processing techniques reducing manufacturing costs and preserving existing manufacturing capabilities. Another embodiment is a two color uncooled microbolometer IR detector providing broadband detection.

Multi-spectral uncooled microbolometer detectors

Techniques that eliminate or otherwise reduce retroreflections associated with focal plane arrays (cooled and uncooled) and other tilted devices are disclosed. The device topology is designed so that incoming radiation is reflected outside of the incoming focusing optical cone. Planarization is used to eliminate concave geometries and angled sidewalls can be used to eliminate convex geometries, as such geometries cause retroreflection. The resultant structure is covered with reflective material (e.g., aluminum, titanium tungsten, or other standard metallization), which not only safely reflects light from the scene, but also prevents reflections from the underlying geometries of the via. Devices configured in accordance with the principles of the present invention require less tilt, thereby minimizing optical distortion.

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Carlisle, MA, United States of America

Jeannie Geneczko