Valeo Systemes De Controle Moteur

Jean-Yves Moreno

Christian Schwartz

Bruno Lefevre

Guillaume Tramet

Benedicte Silvestre

Bénédicte Silvestre

The electrical contact () comprises a contact part () exhibiting a surface () intended to be in contact with the surface of a support, and a clip () intended to receive a pin of an electrical component, so that the pin received lies along a main axis parallel to an up/down direction. The clip () comprises at least two jaws () around the axis A, which are intended to grip the pin laterally, each jaw () exhibiting a fixed end and a free end, and the contact surface is formed by at least one flange () intended to come to bear on said surface of the support.

Electrical contact and electronic circuit

A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.

Electronic module produced by sequential fixation of the components

An electronic module () designed to be installed in a vehicle, comprises a casing () containing at least two circuit boards () connected together by at least one electrical conductor (), the conductor having one of its ends bonded to one of the circuit boards and the other of its ends bonded to the other circuit board, the ends of the conductor being bonded by a 'wedge bonding' technique, the casing also containing a protective resin () coating at least one of the bonded ends of the electrical conductor. This resin is a polyurethane resin.

Electronic module for vehicle

A process for manufacturing an electronic module including a printed-circuit board, at least one first-type component and one second-type component is disclosed. The process involves placing solder on the board, putting the first-type component in a first position, heating the entire board to melt the solder, resulting in soldering of the first-type component, putting the second-type component in a second position such that the second-type component has leads bearing on the board via the solder, and heating the solder locally to melt the solder such that the second-type component is soldered by applying two electrodes on each lead of the second-type component and making an electrical current flow between the electrodes to heat each lead of the second-type component. Each of the two electrodes directly contacts each lead of the second-type component to make the current flow between the two electrodes via the corresponding lead of the second-type component.

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Meru, France

Jean-Yves Moreno