Corning Incorporated

Jean Waku-Nsimba

Michel Prassas

Alain R Carre

Sean Matthew Garner

Alain R E Carre

Ronan Tanguy

Alain Robert Emile Carre

Eric J P Francois

Katrin Wondraczek

Jerome V Davidovits

A process for making a device comprising a thin functional substrate comprising bonding the functional substrate to a carrier substrate, forming functional components on the functional subsrate, and debonding the functional substrate from the carrier substrate by applying ultrasonic wave to the bonding interface. The application of ultrasonic wave aids the debonding step by reducing the tensile stress the functional substrate may experience.

Debonding a glass substrate from carrier using ultrasonic wave

A carrier () for a thin glass sheet () is disclosed. The carrier includes an elastomer () which has first () and second () opposed surfaces and a support () bonded to the first surface () of the elastomer (). During use, the thin glass sheet () directly contacts and is releasably bonded to the elastomer's second surface (). In order to provide a strong, yet releasable bond to the thin glass sheet (), the elastomer's second surface () has a Shore A hardness in the range of 10-90 and a roughness less than or equal to 185 nanometers. In this way, the carrier/glass sheet assembly () is able to withstand the conditions encountered during manufacture of electronic components on the exposed surface () of the thin glass sheet ().

Carrier for glass substrates

Coating for imparting non-stick, abrasion resistant and non-wetting

Material for imparting non-stick and non-wetting properties

Growing community of inventors

La Brosse Montceaux, France

Jean Waku-Nsimba