Lucent Technologies Inc.

Jean S Nyquist

Gary J Grimes

Charles J Sherman

James R Bortolini

Scott E Farleigh

An arrangement for cooling an electronic assembly includes a circuit board, an enclosure member and at least one electromechanical actuator. The circuit board has a first surface, a second surface, and at least a first heat-generating element secured to the first surface. The circuit board further comprises at least one aperture extending between the first surface and the second surface. The enclosure member is secured to the circuit board so as to form a fluid tight barrier of a compartment defined at least in part by the enclosure member. The compartment includes a first subcompartment defined at least in part by the first surface and the enclosure member and a second subcompartment defined at least in part by the second surface and the enclosure member. The at least one electromechanical actuator is secured within the fluid type barrier and is operable to generate a flow movement in the direction of the at least one aperture when liquid is disposed in the fluid tight barrier.

Arrangement for liquid cooling an electrical assembly using assisted flow

An arrangement for cooling an electronic assembly includes a circuit board and an enclosure member. The circuit board has a first surface, a second surface, and at least a first electronic component or other heat-generating element secured to the first surface. The enclosure member is secured to said circuit board so as to form a fluid tight barrier of a compartment defined at least in part by said enclosure member. Such compartment includes a first subcompartment defined at least in part by said first surface and said enclosure member and a second subcompartment defined at least in part by said second surface and said enclosure member. The circuit board further includes at least one aperture extending between the first surface and the second surface such that the first subcompartment is in fluid communication with the second subcompartment.

Arrangement for cooling an electrical assembly

An arrangement for electromagnetically shielding a circuit carrying substrate includes first and second shielding members and a plurality of elastically deformable shielding connectors. The first shielding member has first and second dimensions exceeding first and second dimensions defined by the circuit and is disposed on a first side of the circuit. The second shielding member also has first and second dimensions exceeding first and second dimensions defined by the circuit and is disposed on a second side of the circuit. The first and second shielding members define at least one slot therebetween. Each of the plurality of shielding connectors is both plastically deformable and electrically conductive, and furthermore extends between the first shielding member and the second shielding member. The plurality of shielding connectors are disposed within and throughout said slot and spaced apart by a distance that is less than one-fourth the wavelength of an effective operating frequency of the circuit.

Electromagnetic shielding method and apparatus

An arrangement for cooling an electronic assembly includes a circuit board having a primary circuit board portion and a secondary circuit board portion integrally secured to the primary circuit board portion. The arrangement also includes an enclosure member secured to the circuit board so as to create a fluid tight barrier of a compartment defined at least in part by the enclosure member. The arrangement further includes a first electronic component secured to the primary circuit board portion such that the first electronic component is located within the compartment. The arrangement also includes a second electronic component secured to the secondary circuit board portion such that the second electronic component is located outside of the compartment. The arrangement also includes a liquid disposed within the compartment such that the liquid is in a heat exchange relationship with the first electronic component. The arrangement also includes a gas in contact with the second electronic component such that the gas is in a heat exchange relationship with the second electronic component.

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Denver, CO, United States of America

Jean S Nyquist