M/a -Com, Inc.

Mia-Com, Inc.

Jean-Pierre Lanteri

Noyan Kinayman

Nitin Jain

Richard Alan Anderson

M Tekamul Buber

Bernard A Ziegner

A switch matrix including a plurality of microstrip pairs arranged to form a grid and switches to couple the microstrip pairs where they cross. Each microstrip pair includes a first microstrip and a second microstrip for passing signals. The signals on the first and second microstrips are such that the electromagnetic forces produced by each one are canceled out by the other. By canceling out the electromagnetic forces, undesirable coupling between microstrips that cross and between microstrips and the substrate are minimized, thereby allowing inexpensive substrates such as silicon to be used.

Switch matrix

A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.

RF transition for an area array package

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Waltham, MA, United States of America

Jean-Pierre Lanteri