Centre National De La Recherche Scientifique

Universite Paul Sabatier

Jean Pascal Cambronne

Pierre-Louis Taberna

Patrice Simon

Thierry Lebey

Vincent Bley

Quoc Hung Luan

Jean Marie Tarascon

A method of fabricating an electrically conductive mechanical interconnection element () comprises: a first stage of electrochemically depositing a structure comprising a plurality of metal wires () of sub-micrometric diameter projecting from the likewise metallic surface of a substrate (); and a second stage of controlled partial dissolution of said wires to reduce their diameter. A method of making a mechanical and/or electrical interconnection, the method comprising the steps consisting in: fabricating two interconnection elements by a method as described above; and placing said interconnection elements face to face and pressing one against the other so as to cause the nanometric wires projecting from the surfaces of said elements to interpenetrate and tangle together. A three-dimensional electronic device comprising a stack of microelectronic chips mechanically and electrically connected to one another by such interconnection elements.

Method for making an electrically conducting mechanical interconnection member

Growing community of inventors

Mervilla, France

Jean Pascal Cambronne