Eurotechnique

Jean P Gloton

Philippe Peres

A micromodule or chip carrier package for chip containing components has an insulating support base for carrying a series of flush-mounted contact areas. A semiconductor circuit or chip is placed on one of the contact areas and the chip is connected to the other contact areas by means of wires. A hollow case is mounted over the assembly and has a bore for receiving a drop of resin which has the function of protecting the semiconductor circuit or chip.

Method of fabrication of a chip carrier package, a flush-contact chip

A card having contact pads disposed in rows and spaced in accordance with electronic card standards is provided with a recess for snap-action engagement of a pluggable micromodule having side contacts and containing the core component of the card. The micromodule is connected to the rows of contact pads by means of transfer contacts formed by metallic strips and side contacts within the card recess.

Card containing a component and a micromodule having side contacts

An electronic card which can be reused a large number of times incorporates a semiconductor circuit provided with an area which is erasable by means of electromagnetic radiation within the ultraviolet range of wavelengths. The externally-emitted ultraviolet radiation applied to the semiconductor circuit via a card recess passes through a quartz window and impinges on the erasable area.

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Aix En Provence, France

Jean P Gloton