Valeo Etudes Electroniques

Valeo Equipements Electriques Moteur

Valeo Vision

Centre National De La Recherche Scientifique

Valeo Systemes De Controle Moteur

Université De Versailles—saint-quentin-en-yvelines

Université Paris 13

Valeo Electronique Et Systemes De Liaison

Valéo Equipements Electroniques Moteur

Jean-Michel Morelle

Marc Duarte

Zdravko Zojceski

Jean-Claude Gasquet

Laurent Vivet

Sandra Dimelli

Blaise Rouleau

Alcina Tanghe

Mathieu Medina

Benjamin Morliere

Ky Lim Tan

Anthony Brisset

Stéphane Thomelin

Laurent Deneu-Fontaine

Romaric Lenoir

Patrick Dubus

Gerard-Marie Martin

Renan Leon

Hérve Lorin

Hervé Lorin

Noureddine Jouini

Frédéric Schoenstein

Fadila Maroteaux

Pauline Canaud

Olivier Leloup

Gérard-Marie Martin

Bertrand Torcheux

An illumination and/or signaling device for an automotive vehicle includes a dielectric substrate including a plurality of conductive tracks, and a plurality of light-emitting diodes surface-mounted on the dielectric substrate. The light emitting diodes are electrically connected to the conductive tracks of the dielectric substrate according to a predetermined connection plan. At least one control circuit board for controlling the light-emitting diodes includes a plurality of connecting pins and an electrical connection circuit board including a plurality of conductive lines for electrically connecting the connecting pins of the control circuit board to the conductive tracks of the dielectric substrate according to a predetermined connection plan. The electrical connection circuit board is connected to the conductive tracks of the dielectric substrate via an anisotropic conductive film.

Automotive vehicle lighting device with electrical connection circuit board connected to substrate by anisotropic conductive film

A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation.

Device for assembling a chip on a substrate by providing a solder-forming mass

In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured.

Method for assembling a chip on a substrate

Said electronic power module () includes: a stack () comprising a metal layer forming an electric circuit () and intended for supporting an electronic power component () such as a semiconductor; a metal body forming a heat drain (); and a dielectric material layer () forming an electric insulator and inserted between the electric circuit () and the heat drain (). The stack () includes a composite material body () having a carbon-charged metal matrix. The carbon charge is between 20 and 60 volume percent. Said composite body () is inserted between an area of the electric circuit () and the electric insulator (), said area being intended for supporting the electronic power component ().

Electronic power module, and method for manufacturing said module

A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value.

Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other

The invention relates to a power module (), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (), each chip having a first surface () to be connected to a heat sink substrate (), and a second surface () separate from the first and on which at least one electronic component (-) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.

Power module for an automobile

In accordance with said control method, the transmission of the laser beam is periodically interrupted with the aid of means for masking the laser beam placed between the reference point and a source of the laser beam. Moreover, the transmission power of the source of the laser beam is varied between the minimum and maximum values, such that the emission times of the source of the laser beam at the minimum power substantially coincide with the masking times of the laser beam via the masking means. Preferably, the minimum value is at least equal to 10% and the maximum value at most equal to 90% of a maximum emission power of the source of the laser beam.

Method and device for controlling the power transmitted by a laser to a reference point, soldering device and method

This holder includes a conductor metal part designed to be warmed for assembly of the electrical component on the metal part. It also includes a part made of synthetic material, jointed with the metal part, guaranteeing cohesion of the holder. This part made out of synthetic material contains a mass with a low melting point and a mass with a high melting point, inserted between the mass with a low melting point and the metal part. More specifically, the mass with the high melting point is made in a material with a melting point greater than the melting point of the mass with a low melting point.

Holder for electrical component and electrical device including the holder and component

In this soldering method, a laser is directed onto an end face of the stack in such a manner that the laser heats the stack. At least one parameter of the laser is adjusted to a value that is the image by a mathematical model of at least one thermal characteristic of the stack. The parameter of the laser is a parameter selected from an irradiation duration, a surface area of the end face of the stack that is irradiated by the laser, and an irradiating power of the laser.

Laser soldering using thermal characteristics

In this method, the conductive powder mass is placed on the support, and then the member is placed on the mass and a compression force is applied, urging the member against the mass and the support before heating the mass. The magnitude is increased from an initial value to a first predefined value for agglomerating the mass, which value is less than a plastic deformation threshold of the powder mass. Then, the magnitude is maintained at the first predefined value throughout a predetermined duration for agglomerating the powder mass. Finally, the magnitude is increased from the first value to a second predefined value less than a critical threshold for damaging the member but greater than a minimum threshold for sintering the mass at the predetermined temperature, the second predefined value being greater than the first predefined value.

Method of assembling a member on a support by sintering a mass of conductive powder

The module is of the type comprising an electronic component provided with a conductive face that is electrically connected to a connection member of the component by means of a conductor that is corrugated at least in part so as to define an alternating sequence of oppositely-directed arcs, a first series of arcs being connected to the conductive face of the electronic component. The conductor also includes a second series of arcs opposite to the arcs of the first series and interposed between the arcs of the first series, the second series of arcs being connected to the conductive face of the connection member.

Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module

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Beaugency, France

Jean-Michel Morelle