Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Soitec

Centre National De La Recherche Scientifique

Université Grenoble Alpes

Jean-Michel Hartmann

Oleg Kononchuk

Shay Reboh

Didier Landru

Frank Fournel

Abdelkader Aliane

Karim Hassan

Ludovic Ecarnot

Bertrand Szelag

Julie Widiez

Frederic Mazen

Laurent J Vallier

Philippe Rodriguez

Quentin Wilmart

Pascal Besson

François Rieutord

Willy Ludurczak

Luc Andre

Virginie Loup

Zouhir Mehrez

Hacile Kaya

Etienne Eustache

Franck Bassani

Bassem Salem

Oleg Kononchuck

Mohamed-Aymen Mahjoub

Pierre-Edouard Raynal

Quentin Durlin

A process for hydrophilic bonding first and second substrates, comprising: —bringing the first and second substrates into contact to form a bonding interface between main surfaces of the first and second substrates, and—applying a heat treatment to close the bonding interface. The process further comprises, before the step of bringing into contact, depositing, on the main surface of the first and/or second substrate, a bonding layer comprising a non-metallic material that is permeable to dihydrogen and that has, at the temperature of the heat treatment, a yield strength lower than that of at least one of the materials of the first substrate and of the second substrate located at the bonding interface. The layer has a thickness between 1 and 6 nm, and the heat treatment is carried out at a temperature lower than or equal to 900° C., and preferably lower than or equal to 600° C.

Process for hydrophilically bonding substrates

Growing community of inventors

Grenoble, France

Jean-Michel Hartmann