Applied Micro Circuits Corporation

Jean-Marc Papillon

Steven Jeffrey Martin

Siamak Fazelpour

Francois Guindon

Michel Fleury

A substrate interface system and method are provided for connecting a coplanar waveguide transmission line to a coaxial connector. The system comprises a substrate having a top surface with a coplanar waveguide having a transmission line interposed between coplanar groundplanes. A housing wall assembly has an aperture and an interior surface adjacent the substrate coplanar waveguide. A coaxial connector, mounted in the housing wall assembly through the aperture, has a center conductor connected to the coplanar waveguide transmission line and a ground connected to the housing wall assembly. Extensions are mounted on the wall assembly interior surface, connected to the coplanar waveguide groundplanes. The substrate need not be grounded to the coaxial connector through a substrate bottom surface groundplane/chassis interface. The substrate can include signal trace layers underlying the top surface, and vias proximate to the wall assembly extensions are formed between the coplanar waveguide groundplane and underlying ground layers.

System and method for interfacing a coaxial connector to a coplanar waveguide substrate

An electronic package component includes a flip-chip device mounted to a BGA substrate. The BGA substrate includes conductive traces formed on its upper surface and configured in a coplanar waveguide structure. The package includes a dielectric coating applied over the conductive traces and over the upper surface of the substrate. The coating is formed from a material having a dielectric constant that is equal to or approximately equal to the dielectric constant of the BGA substrate material. The dielectric coating reduces the adverse effects caused by phase velocity dispersion of the signal propagated by the coplanar waveguide.

Growing community of inventors

San Diego, CA, United States of America

Jean-Marc Papillon