Thomson-csf

Jean-Marc Bureau

Francedillaois Bernard

Dominique Broussoux

Philippe Robin

Hugues Facoetti

Ngoc-Tuan Nguyen

Francois Bernard

Christian LeLong

Daniel Dolfi

Gerard Coussot

Claude Vergnolle

Jacques Elziere

Sylvain Lazare

Daniel Le Bail

Jean-Francedillaois Gelly

Sixte De Fraguier

Jean-Fran&ccedil;ois Gelly

Myriam Oudart

Agnés Bidard

Serge Calisti

Fran&ccedil;ois Bernard

The invention relates to a new type of encapsulated surface acoustic wave component and to a method for the batch production of such components. The component comprises a surface acoustic wave device on the surface of a substrate. The encapsulation package furthermore comprises the substrate, a first layer located on the substrate and hollowed out locally at least at the level of the active surface of the surface acoustic wave device, a printed circuit covering entire first layer and conductive via holes going through the unit formed by the first layer and the printed circuit so as to provide for the electrical connection of the surface acoustic wave device from the exterior.

Encapsulated surface acoustic wave component and method of collective fabrication

A process for the fabrication of a multielement acoustic probe. A flexible circuit having conducting tracks on at least one of its sides is used. This circuit is joined to a plate of piezoelectric material having metallizations. Vias are produced through the flexible circuit in order to address the metallizations and to produce electrical contacts within the vias. This process may be used in echography probes.

Method for making a sonoprobe

The invention relates to a surface wave device linked to a base by a conductive material which is anisotropic in a direction perpendicular to the plane of the surface wave device and of the base. This anisotropic conductive material provides for the mechanical efficacy and the encapsulation of the surface wave device. It is deposited locally in the plane of the base, in such a way as to provide for the presence of a cavity in which the surface acoustic waves can propagate.

Surface wave device connected to a base with a conductive adhesive

A method for the packaging of electronic components, including the mounting of at least one electronic component on its active face side to a base, the base including electrical contacts on an external face and connection pads on a face opposite the external face, and including a first series of via holes connecting the electrical contacts and the connection pads and a second series of holes for use in aspiration. A deformable film is deposited on the face opposite to the active face of the electronic component or components. The deformable film is aspirated through the second series of holes from the face opposite the external face of the base, so as to sheath the electronic component or components. The method may furthermore include, on top of the deformable film, a mineral deposition to provide for the hermetic sealing of the components and a conductive deposition to provide for the shielding. Such an application may find particular application to surface wave filters.

Method for the packaging of electronic components

A method of manufacturing a multiple-element acoustic probe including piezoelectric transducers and an array of interconnections connecting the transducers to an electronic signal processing and control device. The probe also includes a continuous ground electrode integrated between the transducers and the acoustic matching elements, facing the piezoelectric transducers, the acoustic matching elements being totally uncoupled from one another mechanically. This probe may be used in medical imaging or underwater imaging.

Method of manufacturing a multiple-element acoustic probe comprising a common ground electrode

Method of making an acoustic probe

The disclosure relates to a mass memory with very large-scale integration as well as to a method for the manufacture of such a memory.

Mass memory and method for the manufacture of mass memories

Process for manufacturing a multi-element acoustic probe, especially an

A thermal detector with a monolithic structure comprises a layer of material sensitive to infrared radiation and an insulating layer constituted by a thermostable polymer that can be deposited as a thin layer and has a microporous structure. This insulating layer enables the thermal decoupling of the sensitive layer from the substrate comprising reading circuits with which the detector is provided. The performance characteristics of currently used monolithic infrared detectors can thus be substantially improved through the notable reduction of the thermal losses in the sensitive layer. This is achieved through the greatly reduced thermal conductivity of the layer of dielectric polymer. Application to infrared imaging devices.

Thermal detector comprising a thermal insulator made of expanded polymer

The invention is a mechanical sensor produced from a polymer film whose upper part (A) is made conductive, the lower part (B) remaining an insulator. When a strain is applied, the mechanical sensor according to the invention distorts, varying the resistance of part (A) and thus allowing the strain to be measured. Preferably, the polymer used is a thermostable polymer.

Mechanical sensor produced from a polymer film

The invention is a method of producing a multilayer polymer-metal system to interconnect integrated circuits which allows two-dimensional electrical and/or optical connections between components, in which a first layer of polymer is deposited on a rigid substrate such that the layer can be separated from the substrate, in which a multilayer interconnection system is then produced on this first layer using industrial methods and in which the rigid substrate is removed after installation and connection of the integrated circuit.

Process for manufacturing a multilayer integrated circuit interconnection

Disclosed is a method for the making of microlenses for optical applications (display for example) resulting from the deposition of a liquid on a substrate, the surface of which has been locally modified so as to increase the wetting capacity of the liquid thereon. The substrate may be a polymer and the wetting liquid may be an organic fluid capable of hardening by an adapted treatment.

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Valbonne, France

Jean-Marc Bureau