Air Products and Chemicals, Inc.

Evonik Degussa Gmbh

Evonik Operations Gmbh

Versum Materials US, LLC

Jean Louise Vincent

Mark Leonard O'Neill

Raymond Nicholas Vrtis

Aaron Scott Lukas

Mark Daniel Bitner

Eugene Joseph Karwacki, Jr

Manchao Xiao

Timothy J Miller

John Anthony Thomas Norman

Brian Keith Peterson

Dingjun Wu

Juan Jesus Burdeniuc

James Douglas Tobias

Jared Denis Bender

Scott Jeffrey Weigel

Mark L Listemann

Ronald Martin Pearlstein

Howard P Withers, Jr

Renee Jo Keller

Kerry R Berger

James Edward MacDougall

Gary Dale Andrew

Robert E Stevens

Mary Kathryn Haas

Robert Hoffman

Scott Edward Beck

Anthony John Lachawiec, Jr

Goran Zarkov

Tadao Yasue

Renée Jo Keller

Sarah Kathryn Coulter

Joel R Rogers

Kerry Renard Berger

Howard Paul Withers, Jr

Mark Leonard O'neill

Robert Francis Hoffman

Robert Edward Stevens

Mark Leo Listemann

Mark Leonhard O'Neill

Anthony J Lachawiec

A composition and process to make polyurethane foam using a stable liquid catalyst composition comprising at least one liquid bismuth carboxylate catalyst and at least one liquid dialkyltin dicarboxylate complex are disclosed. The disclosed composition and process yield polyurethane foam having favorable properties, but requiring less metal. The polyurethane foams produced by this catalyst composition and method are useful for laminated boardstock, construction panels, appliance insulation, spray-applied insulation, seat cushions, and mattresses.

Mixed metal catalyst compositions and methods for making polyurethane foam

Catalyst compositions useful in the production of insulating polyurethane or polyisocyanurate foam are disclosed. The catalyst compositions impart increased stability of a mixture of the catalyst, a halogen-containing blowing agent, and a polyol. These catalyst compositions comprise of at least 10% of a tetraalkylguanidine and at least 10% of a tertiary amine catalyst with an isocyanate reactive group. These improved catalysts can be used with any halogenated blowing agent, and provide substantial stability benefits with the use of hydrofluoroolefins and hydrofluorochloroolefins. In an exemplary embodiment, a process includes providing a pre-mix comprising a hydrohaloolefin blowing agent, at least one polyol, water, and a catalyst comprising 10-50% tetramethylguanidine and 10-90% of one or more of an amine catalyst containing an isocyanate reactive group.

Amine catalyst for improving the stability of polyurethane systems having halogen containing blowing agents

A composition and process to make polyisocyanurate or polyurethane foam using a catalyst composition comprising at least one bismuth carboxylate catalyst and one or more co-catalysts selected from the group of alkali metal carboxylates and quaternary ammonium carboxylate salts, such that the resultant foam has improved insulation properties. The polyisocyanurate or polyurethane foams produced by this catalyst composition and method are useful for laminated boardstock, construction panels, appliance insulation, and spray-applied insulation.

Catalyst compositions and methods for making foam

Catalyst compositions useful in the production of insulating polyurethane or polyisocyanurate foam are disclosed. The catalyst compositions impart increased stability of a mixture of the catalyst, a halogen-containing blowing agent, and a polyol. These catalyst compositions include amine/acid salts with a pH of &#x3c;7.0 which can be used in combined with tertiary amine catalysts and metal-based or ammonium-based trimerization catalyst and at least one metal-based gel catalyst and optionally one or more of an additional catalyst described in (1) or (2). These improved catalysts can be used with any halogenated blowing agent, and provide substantial stability benefits with the use of hydrofluoroolefins and hydrofluorochloroolefins. In an exemplary embodiment, a process includes providing a pre-mix comprising an organic carboxylic di-acid, tri-acid or poly-acid component and contacting a tetraalkylguanidine and/or a tertiary amine containing an isocyanate reactive group with the acid component in the pre-mix to form a mixture of tetraalkylguanidine salt or tertiary amine salt or their combination.

Delay action catalyst for improving the stability of polyurethane systems having halogen containing blowing agents

Methods for preparing polyurethane flexible foam are described, wherein an organic polyisocyanate is reacted with an active hydrogen-containing component such as an organic polyol, in the presence of a urethane catalyst, a blowing agent, optionally a cell opener, and a siloxane-based surfactant composition as a stabilizer for the foam. The siloxane-based surfactant composition comprises a silanol-functionalized organosiloxane having general formula (I), wherein:the R groups are independently a C-Calkyl, phenyl, or &#x2014;OSi(R); provided that at least one R group is a hydroxyl (&#x2014;OH) bonded directly to any silicon atom and X is an integer from 0-200.

Silanol-functionalized compounds for the preparation of polyurethane foams

The present invention is a process for forming an air gap within a substrate, the process comprising: providing a substrate; depositing a sacrificial material by deposition of at least one sacrificial material precursor; depositing a composite layer; removal of the porogen material in the composite layer to form a porous layer and contacting the layered substrate with a removal media to substantially remove the sacrificial material and provide the air gaps within the substrate; wherein the at least one sacrificial material precursor is selected from the group consisting of: an organic porogen; silicon, and a polar solvent soluble metal oxide and mixtures thereof.

Materials and methods of forming controlled void

Alkylethoxylate alcohols or mixtures of alkyl alcohol ethoxylate with an average HLB value between 10 and 15 as compatibilizers for water blown polyurethane foam formulations that are substantially free of nonylphenol ethoxylates are disclosed. The HLB is defined as the mass percent of average structure of the compatibilizer that is hydrophilic, divided by 5. The compatibilizer is mixed into the B-side of the polyurethane formulation. The B-side of the spray foam formulations comprise polyol, water, amine catalyst, and the compatibilizer of the invention such that the water is present at about 2% to about 30% by weight of the B-side formulation, and the compatibilizer is present at about 1% to about 30% by weight of the B-side formulation. The B-side of the formulation may further comprise metal catalysts, flame retardants, silicone surfactants, cell openers, antioxidants, as well as other additives.

NPE-free emulsifiers for water-blown polyurethane spray foam

A chemical vapor deposition method for producing a porous organosilica glass film comprising: introducing into a vacuum chamber gaseous reagents including at least one precursor selected from the group consisting of an organosilane and an organosiloxane, and a porogen that is distinct from the precursor; applying energy to the gaseous reagents in the vacuum chamber to induce reaction of the gaseous reagents to deposit a preliminary film on the substrate, wherein the preliminary film contains the porogen; and removing from the preliminary film substantially all of the porogen to provide the porous film with pores and a dielectric constant less than 2.6.

Methods for using porogens for low k porous organosilica glass films

The present invention is a process for forming an air gap within a substrate, the process comprising: providing a substrate; depositing a sacrificial material by deposition of at least one sacrificial material precursor; depositing a composite layer; removale of the porogen material in the composite layer to form a porous layer and contacting the layered substrate with a removal media to substantially remove the sacrificial material and provide the air gaps within the substrate; wherein the at least one sacrificial material precursor is selected from the group consisting of: an organic porogen; silicon, and a polar solvent soluble metal oxide and mixtures thereof.

A porous organosilica glass (OSG) film consists of a single phase of a material represented by the formula SivOwCxHyFz, where v+w+x+y+z=100%, v is from 10 to 35 atomic %, w is from 10 to 65 atomic %, x is from 5 to 30 atomic %, y is from 10 to 50 atomic % and z is from 0 to 15 atomic %, wherein the film has pores and a dielectric constant less than 2.6. The film is provided by a chemical vapor deposition method in which a preliminary film is deposited from organosilane and/or organosiloxane precursors and pore-forming agents (porogens) wherein the precursor is a compound of the formula R(OR)(O(O)CR)Si&#x2014;R&#x2014;SiR(O(O)CR)(OR)where Rand Rare independently H or C1 to C4 linear or branched, saturated, singly or multiply unsaturated, cyclic, partially or fully fluorinated hydrocarbon; R, Rand Rare independently C1 to C6 linear or branched, saturated, singly or multiply unsaturated, cyclic, aromatic, partially or fully fluorinated hydrocarbon, Rand Rare independently H, C1 to C6 linear or branched, saturated, singly or multiply unsaturated, cyclic, aromatic, partially or fully fluorinated hydrocarbon, n is 0 to 3, m is 0 to 3, q is 0 to 3 and p is 0 to 3, provided that n+m&#x3e;1, n+p 3, and m+q 3, wherein the porogen is selected from the group consisting of norbornadiene, alpha-terpinene, limonene, cyclooctane, and cymene. The porogens are subsequently removed to provide the porous film.

Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants

A chemical vapor deposition process for preparing a low dielectric constant organosilicate (OSG) having enhanced mechanical properties by adjusting the amount of organic groups, such as methyl groups, within the mixture is disclosed herein. In one embodiment of the present invention, the OSG film is deposited from a mixture comprising a first silicon-containing precursor that comprises from 3 to 4 Si&#x2014;O bonds per Si atom, from 0 to 1 of bonds selected from the group consisting of Si&#x2014;H, Si&#x2014;Br, and Si&#x2014;Cl bonds per Si atom and no Si&#x2014;C bonds and a second silicon-containing precursor that comprises at least one Si&#x2014;C bond per Si atom. In another embodiment of the present invention, the OSG film is deposited from a mixture comprising an asymmetric silicon-containing precursor. In either embodiment, the mixture may further contain a porogen precursor to provide a porous OSG film.

Mechanical enhancer additives for low dielectric films

A porous organosilica glass (OSG) film consists of a single phase of a material represented by the formula SiOCHF, where v+w+x+y+z=100%, v is from 10 to 35 atomic %, w is from 10 to 65 atomic %, x is from 5 to 30 atomic %, y is from 10 to 50 atomic % and z is from 0 to 15 atomic %, wherein the film has pores and a dielectric constant less than 2.6. The film is provided by a chemical vapor deposition method in which a preliminary film is deposited from organosilane and/or organosiloxane precursors and pore-forming agents (porogens), which can be independent of, or bonded to, the precursors. The porogens are subsequently removed to provide the porous film. Compositions, such as kits, for forming the films include porogens and precursors. Porogenated precursors are also useful for providing the film.

Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In one aspect of the present invention, an organosilicate glass film is exposed to an ultraviolet light source wherein the film after exposure has an at least 10% or greater improvement in its mechanical properties (i.e., material hardness and elastic modulus) compared to the as-deposited film.

Mechanical enhancement of dense and porous organosilicate materials by UV exposure

Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In certain embodiments of the invention, there is provided a low-temperature process to remove at least a portion of at least one pore-forming material within a composite film thereby forming a porous film. The pore-forming material may be removed via exposure to at least one energy source, preferably an ultraviolet light source, in a non-oxidizing atmosphere.

Non-thermal process for forming porous low dielectric constant films

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Bethlehem, PA, United States of America

Jean Louise Vincent