Interuniversitair Micro-electronica Centrum, Vzw

Siemens N.v.

Limburgs Universitair Centrum

Other

Imec Vzw

Siemens N.v. and Interuniversitair Micro-electronica Centrum Vzw

Limburgs Universitaire Campus

Interuniversitair Micro-elektronic Centrum Vzw

Interuniversitair Micro-electronika Centrum Vzw

Jean Joseph Roggen

Eric Beyne

Marcel Heerman

Ward Aime De Ceuninck

Luc Irena De Schepper

Joost Wille

Lambert Mathias Stals

Rita Van Hoof

Ann Dumoulin

Jozef Van Puymbroeck

Rita Hoof Van

Jozef Puymbroeck Van

A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.

Polymer stud grid array

Polymer stud grid array for microwave circuit arrangements

An apparatus and method for measuring a parameter of a sample or component at a measurement temperature, wherein the parameter and the measurement temperature are measured at substantially the same time. A temperature coefficient of the sample or component is also established by using temperature fluctuations measured at or near the sample at the time at which the parameter is measured. The temperature coefficient is used to correct the measured parameter data and enhance its stability.

Method and apparatus for local temperature sensing for use in performing

Method for local temperature sensing for use in performing high

An apparatus and method for determining the reliability of an electronic component by performing measurements which enable the ageing behavior of a parameter of that component to be predicted over time. The parameter measurements are made in-situ within the oven or environment used to control the temperature at which the measurements are made. The oven is controlled so that its temperature is kept stable, thereby permitting very high resolution measurements to be made over a relatively short time span. The temperature stability of the oven ensures that the changes of the electromagnetic parameter to be measured as a result of temperature fluctuations are negligible relative to the changes as a result of the ageing phenomena which occur in the component over time. The high resolution measurements are then used to model the parameter value as a function of time based on a deterministic model of how that parameter of the component varies over the lifetime of the component. The model is extrapolated over time to determine the reliability of the component as it ages. The result of the invention is a reliable prediction of the component's parameter value as a function of time, which enables a user or manufacturer to know when the parameter value will exceed its intended tolerance values, and either fail or cause the device in which it is incorporated to become unreliable.

Apparatus and method for measuring electromagnetic ageing parameter of a

Growing community of inventors

Lummen, Belgium

Jean Joseph Roggen