International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Jean Jidong Xu

Timothy Andreas Meserth

Karl Klaus Dittus

Vinod Kamath

Brian Michael Kerrigan

Tony Carl Sass

Glenn Edward Myrto

Jeffrey Scott Holland

James Scott Womble

Joel Edwin Walker

Alvin G Davis

William Beauchamp

Whitcomb Randolph Scott, Iii

Jim Drake

Leo H Webster

Michael John Stowell

Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same are disclosed herein. According to an aspect, a system includes a fluid conduit comprising a first portion and a second portion that are fluidly connected to each other for carrying cooling fluid proximate to a first electronic component and a second electronic component of a computing device. The system also includes a first fluid conduit carrier configured to hold the first portion of the conduit. Further, the system includes a second fluid conduit carrier configured to hold the second portion of the conduit. The first fluid conduit carrier and the second fluid conduit carrier are configured to connect to one another.

Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same

First and second memory module connectors are secured in end-to-end alignment on a circuit board for receiving memory modules along a central plane. Each memory module connector has an ejector latch pivotally coupled to the adjacent ends of the memory module connectors to pivot about an axis perpendicular to the plane. A distal portion of an upper arm of each ejector latch lies on opposite sides of the plane, such that the ejector latches interleave when either ejector latch is pivoted to an open position. The adjacent ends of the first and second memory module connectors are separated by a narrow gap, such that pivoting of the either ejector latch from a closed position to an open position will push the other ejector latch toward a closed position.

Interleaving ejector latches enabling a reduced end-to-end spacing between memory module connectors

A method and apparatus for substantially preventing recirculation of heated air from an exhaust outlet of an expansion card to an air inlet of the expansion card, wherein the air inlet and exhaust outlet are both on the same end of the chassis. The apparatus comprises a chassis with a chassis fan, a motherboard within the chassis having an expansion card connector, and an expansion card in communication with the expansion card connector and secured to the front end of the chassis. The expansion card also includes a card fan configured to move cooling air through the air inlet to the exhaust outlet. An air duct redirects the hot air from the exhaust outlet to prevent recirculation into the expansion card and causes the heated air to exit through the chassis fan. The air duct may include a longitudinal segment through a computer module and a lateral segment selectively securable over the exhaust outlet.

Duct system for high power adapter cards

An electromagnetic shield comprising an electrically conductive frame for establishing electrical contact between a chassis wall and an expansion card mounting bracket. The frame has a plurality of spring fingers interconnected about a perimeter of a central opening in the frame, wherein each spring finger defines a central axis that extends outwardly away from the central opening. The frame may include a substantially planar portion adjacent the central opening in the frame, wherein the plurality of spring fingers incline along the central axis to extend out of the plane defined by the substantially planar portion. The incline of the spring fingers allows a mounting bracket to slide laterally without jamming against the side of a spring finger during installation, removal or side-to-side shifting of the mounting plate.

Adapter card electromagnetic compatibility shielding

Growing community of inventors

Cary, NC, United States of America

Jean Jidong Xu