Lem International Sa

Jean-François Lanson

Pascal Morel

Dominik Schläfli

Electrical current transducer including an insulating body, a magnetic core comprising a central passage and a magnetic circuit gap, a magnetic field detector positioned in the magnetic circuit gap, and a sheet metal leadframe conductor arrangement comprising a primary conductor for carrying the current to be measured and secondary conductors for connecting the magnetic field detector to an external circuit, the primary conductor comprising a central portion extending through the central passage of the magnetic core, lateral extension arms extending from opposite ends of the central portion, and connection ends for connection to an external conductor, the secondary conductors comprising a plurality of conductors, each conductor comprising a sensing cell connection pad substantially aligned with the central portion of the primary conductor and a connection end for connection to the external circuit, the insulating body comprising an inner overmold portion surrounding a central portion of the primary conductor and forming a core guide positioning and insulating the magnetic core with respect to the leadframe conductor arrangement. The insulating body further comprises an outer overmold portion molded over the inner overmold portion, the magnetic core, magnetic field sensor, and a central portion of the leadframe conductor arrangement.

Current transducer with integrated primary conductor

A magnetic field sensor comprises a signal conditioning IC and a magnetic field sensor IC, the magnetic field sensor IC being mounted on and connected to the signal conditioning IC. The magnetic field sensor IC comprises a semi-conductor substrate with a sensor active layer disposed an outer facing side of the magnetic field sensor opposite the signal conditioning IC. The sensor active layer is connected to conductive vias that extend through the semi-conductor substrate from said outer facing side to an underside facing the signal conditioning IC, an underside of the conductive via being electrically interconnected to a connection pad on the signal conditioning IC via a chip-on-chip interconnection comprising a conductive bead connection and a solder connection.

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Reignier-Esery, France

Jean-François Lanson