Texas Instruments Corporation

Jean-Francois Vaccani

Michel Chomette

Philippe Tort

A method and system for testing a semiconductor package. At least some of the illustrative embodiments are methods comprising testing a semiconductor package unit () by electrically coupling a top printed circuit board () to a top-side of a semiconductor package unit (), the coupling using electrically conductive top-side pogo pins (A,), and a pair of adjacent top-side pogo pins (A,) bridged using an electrically conductive path (), electrically coupling a bottom printed circuit board () to a bottom-side of the semiconductor package unit (), the coupling using electrically conductive bottom-side pogo pins (B,), said top-side pogo pins (A,) and said bottom-side pogo pins are of substantially equal height (B,), and transmitting test signals from the bottom printed circuit board to the semiconductor device package by way of the bottom-side pogo pins ().

Method and system for testing a semiconductor package

Sound recording and playback device comprising a sound pick-up microphone connected to a recording channel and a playback loudspeaker connected to a channel for playing the recorded sounds, characterised in that the microphone and the loudspeaker consist of one and the same component (5).

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Roquefort-les-Pins, France

Jean-Francois Vaccani